TSM-132-04-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-04-L-DH-A-K-TR is a 64-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch and low-profile design for high-density PCB interconnections. Supplied in tape-and-reel format for automated SMT assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- TSM-132-04-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-132-04-L-DH-A-K-TR?
- 64-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch delivering high-density standard-pitch connections on PCB
- Dual-height (DH) configuration supports mating with through-hole or elevated mating connectors in stacked PCB assemblies
- Tape-and-reel (TR) packaging optimized for automated pick-and-place assembly in high-volume production environments
What is TSM-132-04-L-DH-A-K-TR used for?
The TSM-132-04-L-DH-A-K-TR surface mount terminal strip is suited for backplane connections, embedded computing modules, and industrial control boards that require 64-position dual-row connectivity at standard 0.100" pitch. The dual-height body accommodates mating connectors at varied PCB clearances, making it flexible for stacked board designs. Its tape-and-reel format supports high-throughput SMT manufacturing lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-132-04-L-DH-A-K-TR datasheet?
TSM-132-04-L-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-132-04-L-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TSM-132-04-L-DH-A-K-TR offer for PCB applications?
The TSM-132-04-L-DH-A-K-TR provides 64 positions arranged in a dual-row layout at 0.100" (2.54 mm) pitch, which is a standard spacing widely used in industrial, embedded computing, and backplane interconnect applications requiring reliable high-position-count SMT connections.
How does the dual-height (DH) feature of the TSM-132-04-L-DH-A-K-TR benefit stacked PCB designs?
The dual-height body design allows the TSM-132-04-L-DH-A-K-TR to mate with connectors at different board-to-board clearances, providing design flexibility for stacked PCB assemblies where component height on the adjacent board exceeds the standard 0.100" pitch single-height envelope.
When should a designer choose the TSM-132-04-L-DH-A-K-TR over a through-hole equivalent?
The surface mount TSM-132-04-L-DH-A-K-TR is preferable when board-side space is limited and automated SMT reflow is the primary assembly method, as it eliminates through-hole drilling, reduces PCB thickness constraints, and enables 64 positions to be placed on a single SMT pad pattern with tape-and-reel automation.
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