TSM-132-03-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-03-SM-DH-A-P-TR is a 64-position, dual-row .100" (2.54 mm) pitch surface mount terminal strip with solder mask-defined pads. It offers high-density interconnect with gold-plated contacts for reliable board-to-board connections. Available in tape-and-reel packaging for automated SMT assembly with global distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-132-03-SM-DH-A-P-TR?
- 64-position dual-row SMT terminal strip at .100" (2.54 mm) pitch supporting 32 contacts per row for high-density PCB interconnects
- Solder mask-defined (SM) pad design providing enhanced pad registration accuracy and improved solder joint reliability
- Gold-plated contacts with contact resistance below 20 mΩ ensuring stable signal transmission over the connector lifetime
- Tape-and-reel (TR) packaging for high-volume automated pick-and-place assembly with standard SMT equipment
What is TSM-132-03-SM-DH-A-P-TR used for?
The TSM-132-03-SM-DH-A-P-TR is designed for high-density backplane systems, industrial control modules, and communications boards requiring 64 dual-row positions at .100" pitch. The solder mask-defined pad geometry ensures precise solder deposition for reliable joint formation in demanding thermal environments. Its SMT form factor and tape-and-reel packaging are optimized for high-throughput automated PCB assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-132-03-SM-DH-A-P-TR datasheet?
TSM-132-03-SM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-132-03-SM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the SM designation mean on the TSM-132-03-SM-DH-A-P-TR, and how does it affect PCB pad design?
The SM designation on TSM-132-03-SM-DH-A-P-TR stands for solder mask-defined pads, meaning the copper pad opening is controlled by the solder mask layer rather than the copper outline. This reduces solder bridging risk between adjacent 2.54 mm pitch pads and improves solder joint consistency across all 64 positions during reflow at temperatures up to 260°C.
How many contacts per row does the TSM-132-03-SM-DH-A-P-TR provide?
The TSM-132-03-SM-DH-A-P-TR provides 32 contacts per row across 2 rows, totaling 64 positions at a .100" (2.54 mm) pitch. This configuration supports a wide signal bus or mixed power-and-signal routing on standard 2.54 mm grid PCB layouts.
For which industrial or computing applications is TSM-132-03-SM-DH-A-P-TR best suited?
The TSM-132-03-SM-DH-A-P-TR is best suited for industrial backplane buses, embedded single-board computers, telecom line cards, and test and measurement systems where a 64-position dual-row .100" (2.54 mm) pitch connector is needed and SMT assembly is preferred for production efficiency.
Is the TSM-132-03-SM-DH-A-P-TR a direct alternative to through-hole 64-pin dual-row headers?
Yes. The TSM-132-03-SM-DH-A-P-TR is an SMT alternative to through-hole 64-pin dual-row headers at .100" (2.54 mm) pitch, eliminating the need for drilling plated through-holes. This reduces PCB fabrication cost and allows component placement on both PCB sides, though through-hole variants may offer higher pull-out strength above 30 N per pin in mechanically stressed assemblies.
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