TSM-132-02-SS-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-02-SS-DH-A-P-TR is a 64-position dual-row 0.100" pitch surface mount terminal strip with solder-in-place posts and double-height housing for elevated board clearance. Gold-plated contacts ensure reliable signal integrity for dense board-to-board connections. Tape-and-reel packaging supports automated assembly in high-volume production environments.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-132-02-SS-DH-A-P-TR?
- 64-position dual-row 0.100" (2.54 mm) pitch layout provides high-density signal routing for parallel bus and mixed-signal applications
- SS (solder-in-place) post termination with double-height (DH) housing delivers elevated board clearance for component-rich PCB stacking
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly for consistent placement in high-volume manufacturing
What is TSM-132-02-SS-DH-A-P-TR used for?
The TSM-132-02-SS-DH-A-P-TR is suited for high-density board-to-board interconnects in industrial control systems, embedded computing modules, and telecommunications backplanes where elevated clearance above the PCB surface is required. Its 64-position dual-row design accommodates wide data buses and mixed-signal connections in compact multi-board assemblies. The surface mount solder-in-place posts provide secure mechanical attachment that withstands repeated mating forces and mild vibration environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-132-02-SS-DH-A-P-TR datasheet?
TSM-132-02-SS-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-132-02-SS-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What distinguishes the TSM-132-02-SS-DH-A-P-TR from a standard-height TSM series connector in board stacking applications?
The DH (double-height) designation in TSM-132-02-SS-DH-A-P-TR means the housing stands taller than the standard TSM profile, providing additional clearance between stacked PCBs. This allows components up to approximately 8 mm tall to be placed beneath the connector on the mating board, enabling more flexible component placement in stacked module designs with 64 positions at 0.100" pitch.
How many signal positions does the TSM-132-02-SS-DH-A-P-TR support and at what pitch?
The TSM-132-02-SS-DH-A-P-TR supports 64 positions arranged in 2 rows of 32 contacts each at a 0.100" (2.54 mm) pitch. This configuration is well suited for 32-bit or 64-bit parallel data buses, address lines, and mixed-signal interfaces commonly found in embedded computing, FPGA development boards, and industrial I/O modules.
What soldering process is required for the TSM-132-02-SS-DH-A-P-TR and is it compatible with lead-free reflow?
The TSM-132-02-SS-DH-A-P-TR uses surface mount solder-in-place (SS) posts and is fully compatible with lead-free reflow soldering at peak temperatures around 260°C per IPC/JEDEC J-STD-020 standards. Its Pb-free construction meets RoHS 2 requirements, making it suitable for environmentally compliant production lines without any process modifications.
Is the TSM-132-02-SS-DH-A-P-TR a good alternative to the TSM-132-03-TM-DH-A-P-TR for designs needing pure SMT assembly?
Yes. The TSM-132-02-SS-DH-A-P-TR uses SS (solder-in-place surface mount) posts, whereas the TSM-132-03-TM-DH-A-P-TR uses TM (through-hole mounting tails) requiring bottom-side wave soldering or hand soldering. For pure SMT reflow processes with no through-hole operations, the SS variant is the preferred choice, delivering the same 64-position 0.100" pitch dual-row dual-height performance while staying within a single reflow assembly step.
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