TSM-132-02-F-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-02-F-DH-A-P-TR is a 64-position dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch. The low-profile SMT design and tape-and-reel packaging support automated PCB assembly for board-stacking and signal interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- TSM-132-02-F-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-132-02-F-DH-A-P-TR?
- 64-position dual-row configuration at 0.100 inch pitch for dense signal and power interconnect
- Surface-mount terminal strip with tape-and-reel packaging supports high-volume automated SMT assembly
- Low-profile SMT body minimizes height on crowded PCBs while maintaining reliable electrical contact
What is TSM-132-02-F-DH-A-P-TR used for?
The TSM-132-02-F-DH-A-P-TR is used in board-to-board interconnect designs for FPGA evaluation platforms, embedded computing modules, and industrial backplane systems where 64-pin dual-row connectivity at 0.100 inch pitch is needed. Its surface-mount form factor integrates cleanly into automated reflow assembly processes, reducing manufacturing cost for high-volume production. The connector is also found in test and measurement fixtures requiring reliable, repeatable mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-132-02-F-DH-A-P-TR datasheet?
TSM-132-02-F-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-132-02-F-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does TSM-132-02-F-DH-A-P-TR provide for board interconnect?
The TSM-132-02-F-DH-A-P-TR features 64 positions in a dual-row arrangement with 0.100 inch (2.54 mm) pitch. This high-density layout accommodates 64 signal or power lines across two rows, enabling compact board-to-board or board-to-module connections in embedded computing and industrial control designs.
Can TSM-132-02-F-DH-A-P-TR be assembled using standard automated SMT equipment?
Yes, the TSM-132-02-F-DH-A-P-TR is supplied in tape-and-reel format, making it directly compatible with automated pick-and-place machines and standard reflow soldering processes. The surface-mount terminal strip body self-aligns to the PCB pads at 0.100 inch pitch, enabling consistent placement accuracy during high-volume manufacturing runs.
For a compact FPGA module, how does TSM-132-02-F-DH-A-P-TR compare to through-hole headers in terms of board space?
Unlike through-hole headers that require drilled plated holes and additional barrel depth beneath the board, the TSM-132-02-F-DH-A-P-TR surface-mount design uses only top-side pads, saving roughly 1 mm to 2 mm of stack height and eliminating hole drilling. Its 64-position dual-row layout at 0.100 inch pitch also allows more components on adjacent board areas compared to single-row through-hole alternatives.
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