TSM-132-02-F-DH-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-132-02-F-DH-A-P-TR is a 64-position dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch. The low-profile SMT design and tape-and-reel packaging support automated PCB assembly for board-stacking and signal interconnect applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-132-02-F-DH-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
64
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 64-position dual-row configuration at 0.100 inch pitch for dense signal and power interconnect
  • Surface-mount terminal strip with tape-and-reel packaging supports high-volume automated SMT assembly
  • Low-profile SMT body minimizes height on crowded PCBs while maintaining reliable electrical contact

Applications

The TSM-132-02-F-DH-A-P-TR is used in board-to-board interconnect designs for FPGA evaluation platforms, embedded computing modules, and industrial backplane systems where 64-pin dual-row connectivity at 0.100 inch pitch is needed. Its surface-mount form factor integrates cleanly into automated reflow assembly processes, reducing manufacturing cost for high-volume production. The connector is also found in test and measurement fixtures requiring reliable, repeatable mating cycles.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TSM-132-02-F-DH-A-P-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and what pitch does TSM-132-02-F-DH-A-P-TR provide for board interconnect?

The TSM-132-02-F-DH-A-P-TR features 64 positions in a dual-row arrangement with 0.100 inch (2.54 mm) pitch. This high-density layout accommodates 64 signal or power lines across two rows, enabling compact board-to-board or board-to-module connections in embedded computing and industrial control designs.

Can TSM-132-02-F-DH-A-P-TR be assembled using standard automated SMT equipment?

Yes, the TSM-132-02-F-DH-A-P-TR is supplied in tape-and-reel format, making it directly compatible with automated pick-and-place machines and standard reflow soldering processes. The surface-mount terminal strip body self-aligns to the PCB pads at 0.100 inch pitch, enabling consistent placement accuracy during high-volume manufacturing runs.

For a compact FPGA module, how does TSM-132-02-F-DH-A-P-TR compare to through-hole headers in terms of board space?

Unlike through-hole headers that require drilled plated holes and additional barrel depth beneath the board, the TSM-132-02-F-DH-A-P-TR surface-mount design uses only top-side pads, saving roughly 1 mm to 2 mm of stack height and eliminating hole drilling. Its 64-position dual-row layout at 0.100 inch pitch also allows more components on adjacent board areas compared to single-row through-hole alternatives.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

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James Wright
Supply Chain Director, CircuitPro Ltd, UK