TSM-132-01-FM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-132-01-FM-DH-A-P-TR is a 64-position, 2.54 mm (0.100") pitch dual-row surface-mount terminal strip with through-hole post and tape-and-reel packaging. It offers dual-height design and alignment peg for precise PCB mounting in high-reliability board-to-board and board-to-cable interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64 positions on a 2.54 mm (0.100") pitch dual-row layout providing a large number of signals in a standard footprint
- Dual-height (DH) design with alignment peg (P) ensures accurate PCB placement and stable mechanical retention during soldering
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly on high-volume SMT production lines
Applications
The TSM-132-01-FM-DH-A-P-TR is ideal for board-to-cable or board-to-board interconnects in test equipment, industrial control systems, and embedded computing modules where a 64-position, 2.54 mm pitch dual-row terminal strip provides reliable signal routing. Its alignment peg and dual-height housing ensure stable mechanical mounting, making it suitable for applications such as data acquisition front ends and modular I/O expansion boards with high pin-count interface requirements.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TSM-132-01-FM-DH-A-P-TR offer, and what does the dual-height design mean?
The TSM-132-01-FM-DH-A-P-TR features 64 positions on a 2.54 mm (0.100") pitch in a dual-row arrangement. The dual-height (DH) designation means the connector body has two distinct height levels, allowing it to mate with housings of different stacking heights, which is useful in board-to-cable systems where vertical clearance must match a specific mating connector geometry.
How does the alignment peg on the TSM-132-01-FM-DH-A-P-TR improve PCB assembly reliability?
The alignment peg (-P option) on the TSM-132-01-FM-DH-A-P-TR locates the connector precisely in the PCB footprint before soldering, preventing rotation or shifting of all 64 surface-mount contacts during reflow at peak temperatures up to 260°C. This reduces solder-bridge defects and mis-alignment failures common with large 64-pin connectors during high-speed automated SMT assembly.
When is the TSM-132-01-FM-DH-A-P-TR a suitable choice over a lower-position-count 2.54 mm connector for a modular I/O board?
When a modular I/O expansion board requires 64 or more signal lines in a single connector, the TSM-132-01-FM-DH-A-P-TR consolidates all 64 positions into one 2.54 mm pitch footprint rather than multiple smaller connectors, reducing board area and assembly cost. Its tape-and-reel (TR) format and SMT termination also allow fully automated placement, making it preferable for production runs exceeding several hundred units.
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