TSM-131-04-TM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-04-TM-DH-A-P-TR is a 62-position, 0.100" pitch surface mount terminal strip in a dual-row configuration with a mid-height profile. Designed for high-density board-to-board and module interface connections with reliable gold-plated contacts. Supplied in tape-and-reel packaging for efficient automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row terminal strip on 0.100" (2.54 mm) pitch delivering high-density signal and power distribution across a single connector
- Mid-height (TM) surface mount profile providing optimized board clearance for stacked module and mezzanine card applications
- Tape-and-reel (TR) packaging enabling seamless integration into automated pick-and-place SMT assembly lines at production volume
Applications
The TSM-131-04-TM-DH-A-P-TR is designed for backplane interface headers, embedded computing expansion connectors, and industrial signal distribution modules requiring 62-position dual-row SMT connectivity. Its mid-height profile accommodates stacked card configurations and enclosure-constrained assemblies, while the 0.100" pitch ensures compatibility with standard mating sockets. The tape-and-reel format supports high-volume automated assembly in telecommunications, test equipment, and industrial control system manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the mid-height (TM) profile of the TSM-131-04-TM-DH-A-P-TR benefit stacked PCB module designs?
The TM (mid-height) designation of the TSM-131-04-TM-DH-A-P-TR provides an above-board connector height between the standard and low-profile TSM variants, typically in the 4 mm to 6 mm range. This allows designers of stacked PCB systems to set precise board-to-board spacing that accommodates components on both the carrier and mezzanine board without clearance violations, making it an effective 62-position interconnect for embedded computing modules and expansion cards.
How many contacts per row does the TSM-131-04-TM-DH-A-P-TR provide, and how should signal and ground be distributed?
The TSM-131-04-TM-DH-A-P-TR provides 62 total contacts in a dual-row (DH) arrangement, giving 31 positions per row on a 0.100" pitch. A common design practice is to dedicate one row to signals and interleave ground returns in the adjacent row, or to allocate specific positions for power supply rails of 3.3 V or 5 V. This balanced layout reduces crosstalk and ensures stable reference planes across all 62 contacts in high-speed digital backplane applications.
Is the TSM-131-04-TM-DH-A-P-TR suitable for high-volume procurement and what packaging quantities should buyers expect?
Yes, the -TR suffix confirms the TSM-131-04-TM-DH-A-P-TR is packaged in tape-and-reel format, which is standard for automated SMT assembly lines processing thousands of units per shift. SAMTEC typically packages the TSM series in reels of 250 to 1,000 pieces depending on connector size, with authorized distribution stocking full-reel quantities. Lead times and reel unit counts should be confirmed with SAMTEC's distribution channel for any given 62-position dual-row order volume.
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