TSM-131-04-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-04-SM-DH-A-P-TR is a 62-position dual-row .100" pitch surface mount terminal strip with dual-height solder tails. Offers 2.54 mm grid spacing and tape-and-reel packaging for automated PCB assembly in high-density board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62 positions (2×31) on a .100" (2.54 mm) pitch dual-row SMT layout providing high signal density with a compact connector footprint
- Dual-height (DH) solder tail variant accommodates PCB stackup variations and supports flush or raised board-to-board clearance requirements
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly at high production volumes with consistent placement accuracy
Applications
TSM-131-04-SM-DH-A-P-TR is optimized for high-density board-to-board and board-to-cable interconnection in embedded computing modules, industrial I/O expansion cards, and telecommunications backplane assemblies. Its 62-position dual-height design allows designers to select appropriate standoff clearance while maintaining the 2.54 mm grid standard, enabling flexible PCB stacking in rack-mount and compact industrial systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the dual-height (DH) tail variant of TSM-131-04-SM-DH-A-P-TR differ from standard-height SAMTEC terminal strips in a stacked PCB design?
The dual-height tail option on TSM-131-04-SM-DH-A-P-TR provides taller solder tails than the standard variant, increasing the board-to-board clearance to accommodate components exceeding 4 mm in height between mated boards, while still maintaining the 2.54 mm .100" pitch across all 62 positions.
For a high-volume embedded controller production run, what packaging format does TSM-131-04-SM-DH-A-P-TR offer and what assembly benefit does it provide?
TSM-131-04-SM-DH-A-P-TR ships in tape-and-reel (TR) format compatible with standard pick-and-place equipment, supporting placement accuracies within ±0.05 mm on 2.54 mm pitch pads, which reduces mis-placement defect rates and cuts manual handling time in high-volume SMT production runs.
In a backplane assembly requiring 60+ signal paths, why select TSM-131-04-SM-DH-A-P-TR over a wire-to-board connector with the same pin count?
TSM-131-04-SM-DH-A-P-TR routes 62 signals on a 2.54 mm (.100") pitch directly between two PCBs with a single SMT-mount step, eliminating discrete wire harnesses and reducing assembly time by more than 50% compared to hand-wired wire-to-board alternatives in backplane configurations.
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