TSM-131-04-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-131-04-SM-DH-A-P-TR is a 62-position dual-row .100" pitch surface mount terminal strip with dual-height solder tails. Offers 2.54 mm grid spacing and tape-and-reel packaging for automated PCB assembly in high-density board interconnect applications.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-131-04-SM-DH-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
62
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 62 positions (2×31) on a .100" (2.54 mm) pitch dual-row SMT layout providing high signal density with a compact connector footprint
  • Dual-height (DH) solder tail variant accommodates PCB stackup variations and supports flush or raised board-to-board clearance requirements
  • Tape-and-reel (TR) packaging enables automated pick-and-place assembly at high production volumes with consistent placement accuracy

Applications

TSM-131-04-SM-DH-A-P-TR is optimized for high-density board-to-board and board-to-cable interconnection in embedded computing modules, industrial I/O expansion cards, and telecommunications backplane assemblies. Its 62-position dual-height design allows designers to select appropriate standoff clearance while maintaining the 2.54 mm grid standard, enabling flexible PCB stacking in rack-mount and compact industrial systems.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TSM-131-04-SM-DH-A-P-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does the dual-height (DH) tail variant of TSM-131-04-SM-DH-A-P-TR differ from standard-height SAMTEC terminal strips in a stacked PCB design?

The dual-height tail option on TSM-131-04-SM-DH-A-P-TR provides taller solder tails than the standard variant, increasing the board-to-board clearance to accommodate components exceeding 4 mm in height between mated boards, while still maintaining the 2.54 mm .100" pitch across all 62 positions.

For a high-volume embedded controller production run, what packaging format does TSM-131-04-SM-DH-A-P-TR offer and what assembly benefit does it provide?

TSM-131-04-SM-DH-A-P-TR ships in tape-and-reel (TR) format compatible with standard pick-and-place equipment, supporting placement accuracies within ±0.05 mm on 2.54 mm pitch pads, which reduces mis-placement defect rates and cuts manual handling time in high-volume SMT production runs.

In a backplane assembly requiring 60+ signal paths, why select TSM-131-04-SM-DH-A-P-TR over a wire-to-board connector with the same pin count?

TSM-131-04-SM-DH-A-P-TR routes 62 signals on a 2.54 mm (.100") pitch directly between two PCBs with a single SMT-mount step, eliminating discrete wire harnesses and reducing assembly time by more than 50% compared to hand-wired wire-to-board alternatives in backplane configurations.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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