TSM-131-04-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-04-H-DH-A-P-TR is a 62-position dual-row surface mount terminal strip with 0.100" pitch, offering reliable SMT board-to-board connectivity for high-density PCB designs in industrial and embedded applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- TSM-131-04-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62 positions on a dual-row 0.100" (2.54 mm) pitch layout for high-density SMT board interconnection
- Surface mount termination eliminates through-hole drilling, simplifying high-volume PCB assembly and reflow soldering
- SAMTEC precision manufacturing ensures consistent contact force and low insertion loss across all 62 positions
Applications
The TSM-131-04-H-DH-A-P-TR is suited for high-density SMT board-to-board and board-to-module interconnects in embedded computing, industrial control systems, and test equipment. Its 62-position dual-row layout at 0.100" pitch enables compact routing of power and signal lines in a single connector footprint. The tape-and-reel packaging supports automated pick-and-place assembly in high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-131-04-H-DH-A-P-TR have, and what is its contact pitch?
The TSM-131-04-H-DH-A-P-TR has 62 positions arranged in a dual-row configuration with a 0.100 inch (2.54 mm) contact pitch. This spacing is compatible with standard 0.100 inch grid PCB layouts, making it easy to route traces and match mating connector footprints in industrial and embedded system designs.
For a compact embedded system PCB, what assembly advantages does the SMT termination of the TSM-131-04-H-DH-A-P-TR offer?
Surface mount termination on the TSM-131-04-H-DH-A-P-TR allows the connector to be placed and reflowed during standard SMT assembly, eliminating the wave-soldering or hand-soldering steps required for through-hole connectors. This reduces assembly cycle time and enables use of double-sided PCB layouts in systems with 62 signal or power connections.
What tape-and-reel packaging does the TSM-131-04-H-DH-A-P-TR come in, and how does this affect production volume planning?
The -TR suffix on the TSM-131-04-H-DH-A-P-TR denotes tape-and-reel packaging, which feeds directly into automated pick-and-place machines. This packaging is optimal for production runs exceeding hundreds to thousands of units, reducing per-unit handling cost and minimizing placement errors on 62-position SMT connector footprints.
In what industrial or computing applications is the TSM-131-04-H-DH-A-P-TR typically used as a board-to-module interconnect?
The TSM-131-04-H-DH-A-P-TR is commonly used in SBC daughter-card connections, FPGA mezzanine modules, industrial I/O expansion boards, and test fixture interfaces where 62 pins at 0.100 inch pitch carry mixed signal and power lines. Its SMT footprint suits backplane designs in 19-inch rack equipment and rugged embedded computing platforms.
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