TSM-131-03-T-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-03-T-DH-A-K-TR is a 62-position surface-mount terminal strip with 0.100" pitch and dual-row layout. Designed for high-reliability board-to-board interconnects with tape-and-reel packaging for automated assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- TSM-131-03-T-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-131-03-T-DH-A-K-TR?
- 62-position dual-row layout supporting high pin-count board-to-board connections
- 0.100" (2.54 mm) pitch for compatibility with standard through-hole and SMT headers
- Surface mount termination enabling automated SMT reflow assembly
- Tape-and-reel packaging for efficient high-volume pick-and-place production
What is TSM-131-03-T-DH-A-K-TR used for?
The TSM-131-03-T-DH-A-K-TR is used in backplane, daughter card, and mezzanine interconnect applications in industrial control, telecom, and computing systems. Its 62-position dual-row 0.100" pitch design provides robust signal and power distribution across mated board pairs. The surface-mount format integrates seamlessly into standard SMT assembly workflows for volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-131-03-T-DH-A-K-TR datasheet?
TSM-131-03-T-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-131-03-T-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TSM-131-03-T-DH-A-K-TR support dense board-to-board interconnects?
TSM-131-03-T-DH-A-K-TR provides 62 positions in a dual-row surface-mount terminal strip, giving designers a dense interconnect on a 0.100 inch pitch.
Which SMT assembly details should be reviewed for the TR packaging option?
The TR option supports tape-and-reel handling, so manufacturers should verify the 62-position footprint, pick-and-place orientation, and solder-pad design before volume assembly.
When would this SAMTEC TSM part be preferred over a smaller connector?
Choose this part when the design needs more I/O capacity, because 62 positions can carry more board-level signals than a 20-pin or 40-pin header.
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