TSM-131-03-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-131-03-SM-DH-A-P-TR is a 62-position, 2.54 mm (0.100 inch) pitch triple-row surface-mount terminal strip with dual-height housing and tape-and-reel packaging, optimized for dense board-level interconnection in automated SMT assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-131-03-SM-DH-A-P-TR?
- 62-position triple-row layout at 2.54 mm (0.100 inch) pitch delivers high signal density while maintaining standard footprint compatibility
- Dual-height (DH) housing provides flexible vertical mating clearance, accommodating varying board-to-board stacking distances in multi-layer assemblies
- Tape-and-reel (TR) delivery enables seamless high-speed pick-and-place integration, reducing placement cycle time in volume SMT production lines
What is TSM-131-03-SM-DH-A-P-TR used for?
The TSM-131-03-SM-DH-A-P-TR serves dense board interconnect needs in server blade systems, telecommunications line cards, and industrial computing platforms where 62 positions must be accommodated within a compact triple-row 0.100 inch pitch footprint. The dual-height design helps engineers manage precise vertical alignment between mated boards in stacked assemblies. Tape-and-reel packaging ensures uninterrupted feed during high-throughput automated soldering operations.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-131-03-SM-DH-A-P-TR datasheet?
TSM-131-03-SM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-131-03-SM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-131-03-SM-DH-A-P-TR provide, and what pitch does it use?
The TSM-131-03-SM-DH-A-P-TR provides 62 positions arranged in 3 rows at a 2.54 mm (0.100 inch) pitch. This triple-row layout maximizes interconnect density on the PCB, making it ideal for data bus, signal, and power distribution in compact board-to-board applications.
How does the dual-height (DH) feature of this Samtec terminal strip support different board stacking heights?
The dual-height housing design offers two selectable mating profiles, typically accommodating board separation distances ranging from approximately 8 mm to 15 mm. This allows system designers to maintain mechanical tolerance during assembly of multi-layer card stacks found in server blades and industrial rack-mount controllers.
When is TSM-131-03-SM-DH-A-P-TR preferred over a through-hole version of the same connector family?
Surface-mount termination of TSM-131-03-SM-DH-A-P-TR eliminates through-hole drilling, saving up to 0.4 mm in board thickness per layer and cutting per-hole fabrication cost. Paired with tape-and-reel packaging, it supports automated placement at throughputs above 8,000 components per hour, making it the preferred choice for cost-optimized, high-volume PCB production runs.
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