TSM-131-02-TM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-02-TM-DH-A-P-TR is a 62-position, dual-row surface mount terminal strip with 2.54 mm (0.100") pitch and TM-style SMT termination. Supplied in tape-and-reel format, it supports automated pick-and-place assembly for high-density PCB interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row DH layout at 2.54 mm (0.100") pitch maximizes contact density in a compact SMT connector footprint
- TM-style surface mount termination provides a low-profile board-level connection compatible with standard reflow soldering processes
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume PCB production environments
Applications
The TSM-131-02-TM-DH-A-P-TR is designed for board-to-board and module-to-backplane interconnection in industrial automation systems, embedded computing platforms, and test instrumentation requiring a 62-contact, 0.100" pitch dual-row SMT header. Its tape-and-reel packaging and TM-style termination simplify integration into automated SMT assembly workflows for high-volume manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and total contact count of the TSM-131-02-TM-DH-A-P-TR connector?
The TSM-131-02-TM-DH-A-P-TR has 62 total contacts arranged in 2 rows of 31 positions each at a 2.54 mm (0.100") pitch. This dual-row DH layout provides a high-density interconnect solution compatible with standard 0.100" footprint PCB designs used across industrial and embedded computing applications.
How does the TM-style termination of TSM-131-02-TM-DH-A-P-TR differ from L-style or T-style options in the TSM series?
TM-style termination in the SAMTEC TSM series uses surface mount tails oriented for specific board-edge or mid-board placement configurations, distinct from the right-angle profile of T-style or the vertical L-style. All variants share the same 2.54 mm pitch and 62-contact dual-row layout, but TM provides a tailored solder tail geometry for specific PCB land pattern requirements.
Is TSM-131-02-TM-DH-A-P-TR suitable for high-volume automated assembly, and how is it packaged?
Yes, the TSM-131-02-TM-DH-A-P-TR is supplied in tape-and-reel (TR) format, making it directly compatible with automated pick-and-place SMT equipment and standard reflow soldering lines. The 62-position SMT footprint at 2.54 mm pitch integrates into high-volume production with no manual handling required for placement.
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