TSM-131-02-T-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-02-T-DH-P-TR is a 62-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, featuring tall solder tails and dual-height body for stackable PCB configurations. Provides 31 contacts per row on the industry-standard 0.100" grid for reliable signal and power routing. From $2.00 in stock, worldwide shipping available.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- TSM-131-02-T-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-131-02-T-DH-P-TR?
- 62-position dual-row layout on 0.100" (2.54 mm) pitch with 31 contacts per row for broad signal distribution
- Dual-height (DH) body and tall (T) tail design supports elevated mating and stacked PCB configurations
- Tape-and-reel (TR) format enables automated SMT pick-and-place assembly in production environments
What is TSM-131-02-T-DH-P-TR used for?
The TSM-131-02-T-DH-P-TR serves as a versatile 62-pin interface connector in embedded computing, industrial automation, and test and measurement systems requiring 0.100" pitch dual-row connectivity. The dual-height body provides adequate clearance for stacked daughter boards and mezzanine modules. Its tape-and-reel packaging allows seamless integration into high-volume SMT manufacturing lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-131-02-T-DH-P-TR datasheet?
TSM-131-02-T-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-131-02-T-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TSM-131-02-T-DH-P-TR provide?
The TSM-131-02-T-DH-P-TR offers 62 positions in a dual-row configuration with a 0.100" (2.54 mm) pitch, delivering 31 contacts per row on the widely used standard 0.1" grid for versatile signal and power interconnection.
What stacking height does the dual-height (DH) body of TSM-131-02-T-DH-P-TR enable?
The DH (dual-height) body designation provides an increased standoff above the PCB surface compared to standard TSM connectors, allowing mezzanine daughter boards to stack with several millimeters of clearance. The tall (T) tail adds solder penetration depth for enhanced mechanical retention on SMT pads at 0.100" pitch.
In which industrial and embedded applications is TSM-131-02-T-DH-P-TR typically used?
TSM-131-02-T-DH-P-TR is commonly deployed in industrial PLC expansion modules, FPGA evaluation boards, and SBC daughter card connectors where 62 pins of dual-row 0.100" pitch surface mount connectivity are required. The stacking capability makes it valuable for modular system architectures needing 3.3 V or 5 V mixed signal and power routing across multiple PCB layers.
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