TSM-131-01-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-131-01-F-DH-A-K-TR is a 62-position, 0.100" pitch dual-row female surface mount terminal strip with keep-out option and tape-and-reel packaging for automated PCB assembly. From $5.00 in stock worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- TSM-131-01-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-131-01-F-DH-A-K-TR?
- 62-position dual-row 0.100" pitch female surface mount terminal strip for high-density board interconnection
- K keep-out option provides required component exclusion zone for defect-free SMT reflow assembly
- Tape-and-reel packaging optimizes automated pick-and-place throughput at 0.100" pitch for volume production
- DH dual-height option supports precise board-to-board stacking with defined standoff height
What is TSM-131-01-F-DH-A-K-TR used for?
The TSM-131-01-F-DH-A-K-TR provides reliable high-density interconnection for embedded computing platforms, test equipment backplanes, and industrial control boards requiring 62 contacts at the standard 0.100" pitch. The dual-row female configuration mates with industry-standard 0.100" male headers on processor modules, I/O expansion cards, and signal conditioning boards in data acquisition systems. Its tape-and-reel format and keep-out option are tailored for volume SMT assembly operations in industrial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-131-01-F-DH-A-K-TR datasheet?
TSM-131-01-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-131-01-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal connections does the TSM-131-01-F-DH-A-K-TR provide, and what pitch does it use?
The TSM-131-01-F-DH-A-K-TR provides 62 positions at a 0.100" (2.54 mm) pitch, arranged across 2 rows of 31 contacts each, enabling connection of up to 62 signals or mixed signal and power lines in a single standard-pitch surface mount connector.
For which type of module stacking design is the dual-height (DH) option in TSM-131-01-F-DH-A-K-TR particularly valuable?
The DH (dual-height) feature is especially useful for mezzanine and sandwich-board stacking designs where a controlled 0.100" to 0.200" vertical clearance between two PCBs is required, such as in compact embedded controllers, military computing modules, and industrial automation daughter cards with defined thermal management gaps.
Can the TSM-131-01-F-DH-A-K-TR withstand vibration and shock in industrial or transportation electronics?
Yes, the through-hole solder pads and dual-row 62-pin layout of TSM-131-01-F-DH-A-K-TR provide sufficient mechanical strength to meet industrial vibration standards such as IEC 60068-2-6, withstanding acceleration levels up to 20 g at frequencies between 10 Hz and 2,000 Hz in vehicle electronics and factory automation applications.
What procurement advantage does the tape-and-reel format of TSM-131-01-F-DH-A-K-TR offer compared to bulk tray packaging?
Tape-and-reel delivery reduces per-unit handling time by enabling direct feeder loading into SMT pick-and-place machines, cutting manual placement cost by 60 to 80 percent compared to tray-fed connectors, and is essential for production lines assembling more than 500 boards per day at 0.100" pitch accuracy.
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