TSM-130-05-T-SH-P-TR SAMTEC Connector (Other) In Stock
TSM-130-05-T-SH-P-TR is a SAMTEC 30-position dual-row surface mount terminal strip on a 0.100" (2.54 mm) pitch with vertical orientation and tape-and-reel packaging, available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TSM-130-05-T-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30 positions on 0.100" (2.54 mm) pitch providing high-density dual-row connectivity on a compact PCB footprint
- Surface-mount vertical orientation enabling automated SMT placement with no through-hole drilling required
- Tape-and-reel (TR) packaging compatible with high-volume pick-and-place assembly lines
- SAMTEC quality construction rated for repeated mating cycles in backplane and board-to-board interconnect applications
Applications
The TSM-130-05-T-SH-P-TR is used in board-to-board and card-to-backplane interconnect applications where a 30-contact, 0.100" pitch dual-row header is required on a surface-mount pad layout. Its vertical profile suits compact industrial control boards, test and measurement equipment, and embedded computing modules where vertical card stacking or ribbon-cable termination is needed. The tape-and-reel format supports high-volume automated assembly for production PCBs in telecommunications and data-acquisition systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many electrical contacts does the TSM-130-05-T-SH-P-TR provide, and what is the row and pitch configuration?
The TSM-130-05-T-SH-P-TR provides 30 total positions arranged in a dual-row layout on a standard 0.100" (2.54 mm) pitch, giving 15 contacts per row. This 2×15 arrangement is a common standard in backplane and card-edge systems, allowing up to 30 independent signal or power connections within a footprint under 40 mm long.
What assembly method is required for the TSM-130-05-T-SH-P-TR, and does it support automated pick-and-place?
The TSM-130-05-T-SH-P-TR is a surface-mount component in tape-and-reel (TR) packaging, making it fully compatible with automated SMT pick-and-place equipment and standard lead-free reflow solder profiles at 260 °C peak. No through-hole drilling is needed, reducing PCB fabrication cost and enabling double-sided assembly on thin 1.6 mm FR4 substrates.
In what types of industrial or embedded applications is the TSM-130-05-T-SH-P-TR typically specified?
This connector is commonly specified in industrial PLC backplanes, test-and-measurement instrument daughter-card interfaces, and embedded single-board computers that use 0.100" pitch ribbon-cable or mating receptacle interconnects. The 30-pin count supports mixed signal and power routing, for example 24 data lines plus 6 power/ground rails, across card-edge interfaces in data-acquisition modules operating over a wide -55 °C to +125 °C temperature range.
When is the TSM-130-05-T-SH-P-TR a better connector choice than an equivalent through-hole strip for a high-volume PCB build?
For production volumes above a few hundred units, the surface-mount TSM-130-05-T-SH-P-TR eliminates manual insertion labor and wave-solder fixturing associated with through-hole alternatives. The tape-and-reel format supports reel sizes of 1000+ pieces, reducing per-unit handling cost by roughly 30–50% compared to cut-tape through-hole headers, while maintaining the same 0.100" mating compatibility with standard 2×15 female connectors.
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