TSM-130-05-S-SH-P-TR SAMTEC Connector (Other) In Stock
TSM-130-05-S-SH-P-TR is a 30-position single-row vertical surface-mount terminal strip from SAMTEC with 0.100-inch pitch and integrated shielding. It provides high-density SMT connectivity for 30-channel signal interfaces with EMI protection. Available from stock worldwide in tape-and-reel packaging for automated production assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TSM-130-05-S-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-05-S-SH-P-TR?
- 30-position single-row vertical SMT terminal strip at 0.100-inch (2.54 mm) pitch for standard-grid high-channel-count board interfaces
- Integral shield (SH) housing suppressing EMI coupling on 30 signal lines adjacent to power and RF circuits on dense PCBs
- Tape-and-reel (TR) packaging enabling automated high-volume SMT assembly with standard pick-and-place equipment
What is TSM-130-05-S-SH-P-TR used for?
The TSM-130-05-S-SH-P-TR addresses high-channel-count surface-mount connector requirements in industrial PLCs, data acquisition systems, and embedded processing boards where 30 signal positions at 0.100-inch pitch must fit within a shielded SMT footprint. Its straight (S) single-row vertical profile keeps the connector height minimal for low-clearance PCB stack configurations. Engineers deploy this terminal strip in multi-channel sensor interfaces, I/O expansion headers, and backplane signal distribution where shielding reduces cross-channel noise on adjacent signal lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-05-S-SH-P-TR datasheet?
TSM-130-05-S-SH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-05-S-SH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the TSM-130-05-S-SH-P-TR accommodate 30 positions at 0.100-inch pitch compared to lower-count alternatives in the TSM series?
The TSM-130-05-S-SH-P-TR spans approximately 3.0 inches of PCB edge in a single-row configuration at 0.100-inch (2.54 mm) pitch, providing 30 individual signal channels, which is 8 more than the 22-position TSM-122 variant and 17 more than the 13-position TSM-113, making it the preferred choice for I/O-intensive applications needing maximum channel count in a single connector.
In a 30-channel sensor data logger design, what EMI benefit does the SH shield on the TSM-130-05-S-SH-P-TR provide?
The SH shield wraps the 30-position housing in a grounded metal enclosure that typically provides 15 dB to 25 dB of EMI attenuation for frequencies from 30 MHz to 1 GHz, protecting low-level analog sensor signals on adjacent pins from radiated interference generated by nearby DC-DC converters, clock lines, or wireless modules on the same PCB.
Can the TSM-130-05-S-SH-P-TR be used as a drop-in replacement for through-hole 30-position headers in a redesigned PCB layout?
No, the TSM-130-05-S-SH-P-TR uses SMT solder-pad footprints rather than through-hole drill holes, so a PCB redesign is required, but its 0.100-inch pitch matches standard 30-position through-hole header spacing, meaning only the pad type changes while 2.54 mm column spacing and 30-pin count remain identical, simplifying schematic reuse and harness compatibility.
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