TSM-130-04-TL-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-04-TL-DH-A-P-TR is a 60-position surface mount terminal strip with 0.100" (2.54 mm) pitch and dual-row design for high-density PCB-to-board signal interconnections. Tape-and-reel packaging supports automated SMT assembly for industrial and embedded computing designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch enables high-density parallel signal and power routing
- Tape-and-reel (TR) packaging compatible with automated pick-and-place SMT assembly for high-volume production runs
- RoHS-compliant construction provides long-term reliability in industrial, telecommunications, and embedded computing applications
Applications
The TSM-130-04-TL-DH-A-P-TR is designed for high-pin-count board-to-board connections in embedded computing modules, industrial backplanes, and multi-function daughter cards requiring 60 signals at 2.54 mm pitch in a compact surface mount footprint. Its tape-and-reel format makes it well suited for automated SMT production lines in telecommunications equipment, server platforms, and complex embedded controller designs that demand reliable multi-row interconnections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TSM-130-04-TL-DH-A-P-TR provide in its dual-row layout?
The TSM-130-04-TL-DH-A-P-TR provides 60 positions arranged in dual rows at 0.100 inch (2.54 mm) pitch, with 30 contacts per row. This allows simultaneous routing of 60 independent signal or power lines in a single connector, reducing the complexity and cost of using multiple smaller connectors in backplane and embedded module designs.
For an industrial backplane requiring over 50 signal connections, how does TSM-130-04-TL-DH-A-P-TR reduce PCB complexity?
By consolidating 60 connections into a single dual-row surface mount footprint at 2.54 mm pitch, the TSM-130-04-TL-DH-A-P-TR eliminates the need for multiple stacked connectors. This reduces total connector count, simplifies PCB routing for 30-bit or wider parallel buses, and lowers assembly time in industrial control systems and server backplane designs with high signal density requirements.
What production benefits does the tape-and-reel suffix indicate for the TSM-130-04-TL-DH-A-P-TR?
The TR (tape-and-reel) packaging means the TSM-130-04-TL-DH-A-P-TR is delivered on standard component reels compatible with automated SMT pick-and-place machines. This packaging format minimizes manual handling, reduces placement errors on 60-pin footprints at 2.54 mm pitch, and supports high-volume production throughput in ISO-certified SMT assembly lines for industrial and telecommunications hardware.
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