TSM-130-04-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-04-SM-DH-A-P-TR is a 60-position, 0.100 inch pitch dual-row surface-mount terminal strip with surface-mount tails and dual-height design. Tape-and-reel packaging supports automated SMT assembly. Available worldwide from authorized distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-04-SM-DH-A-P-TR?
- 60-position dual-row layout at 0.100 inch (2.54 mm) pitch provides high signal density for board-to-board interconnect
- Surface-mount (SM) tail style enables reflow soldering for reliable automated PCB assembly
- Tape-and-reel (TR) packaging delivers compatibility with high-volume pick-and-place SMT production lines
- Dual-height (DH) configuration maintains controlled inter-board spacing in stacked PCB assemblies
What is TSM-130-04-SM-DH-A-P-TR used for?
The TSM-130-04-SM-DH-A-P-TR is intended for high-density board-to-board signal connections in stacked PCB assemblies such as industrial computing modules, embedded controller boards, and backplane expansion cards requiring 60 positions at a 0.100 inch pitch. Its surface-mount termination with tape-and-reel packaging makes it ideal for automated high-volume SMT manufacturing lines handling complex multi-board assemblies. The dual-height feature provides a defined standoff between mated boards, improving airflow and reducing mechanical stress on solder joints.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-04-SM-DH-A-P-TR datasheet?
TSM-130-04-SM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-04-SM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total pin count and pitch of the TSM-130-04-SM-DH-A-P-TR, and how does it fit stacked board designs?
The TSM-130-04-SM-DH-A-P-TR provides 60 positions in a dual-row layout at a 0.100 inch (2.54 mm) pitch, with 30 contacts per row. Its dual-height (DH) design supports a defined inter-board gap when mated, which is essential in stacked PCB configurations requiring controlled thermal clearance and mechanical standoff between adjacent boards in industrial and embedded computing systems.
How does the surface-mount (SM) tail termination of the TSM-130-04-SM-DH-A-P-TR affect the PCB assembly process?
The surface-mount tail termination allows the TSM-130-04-SM-DH-A-P-TR to be soldered directly to PCB pads using standard reflow oven processes, eliminating the need for through-hole drilling and wave soldering. This reduces board fabrication cost, improves solder joint consistency across all 60 positions, and makes the connector compatible with fully automated SMT assembly lines processing double-sided PCBs in a single reflow pass.
What production volume scenarios justify choosing the tape-and-reel (TR) variant of the TSM-130-04-SM-DH-A-P-TR?
Tape-and-reel packaging is most beneficial for production runs of approximately 500 or more units, where automated pick-and-place machines can handle each 60-pin connector without operator intervention. For prototyping or small quantities under 50 units, a tray or bulk-packaged variant may be more economical. The TR format reduces placement errors, ensures consistent connector orientation, and maximizes throughput on high-speed SMT lines processing boards with multiple connectors per panel.
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