TSM-130-04-FM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-04-FM-DH-A-P-TR is a 60-position, 0.100" (2.54 mm) pitch dual-row surface mount terminal strip with gold-plated contacts and tape-and-reel packaging. Provides a reliable high-density interconnect solution for board-to-board signal routing and development board headers. Designed for automated SMT assembly with a standard 2.54 mm grid footprint.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-04-FM-DH-A-P-TR?
- 60-position dual-row layout on 0.100" (2.54 mm) pitch delivers 30 pins per row for high-density board-to-board and wire-to-board signal routing
- Gold-plated contacts (FM designation) provide low contact resistance and corrosion resistance through hundreds of mating cycles in demanding environments
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly, eliminating manual connector placement in volume PCB production
What is TSM-130-04-FM-DH-A-P-TR used for?
TSM-130-04-FM-DH-A-P-TR is used in high-density board-to-board interconnect applications such as FPGA daughter cards, microcontroller evaluation platforms, and backplane signal distribution headers where 60 pins at 2.54 mm pitch are required. Its dual-row design suits bus expansion connectors on industrial control modules, test fixture contact points, and prototype development boards needing a large number of accessible signal lanes. The SMT footprint with through-hole tail support option provides additional mechanical stability in vibration-prone environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-04-FM-DH-A-P-TR datasheet?
TSM-130-04-FM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-04-FM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions per row does TSM-130-04-FM-DH-A-P-TR have, and what is the connector pitch?
TSM-130-04-FM-DH-A-P-TR has 60 total positions split into 2 rows of 30 pins each, arranged on a 0.100" (2.54 mm) pitch. The 2.54 mm grid is an industry-standard spacing compatible with a wide range of mating receptacles, IDC flat cable connectors, and wire-to-board jumper housings, making sourcing of mating parts straightforward.
What does the FM contact plating designation mean for TSM-130-04-FM-DH-A-P-TR in low-level signal applications?
The FM designation in TSM-130-04-FM-DH-A-P-TR indicates gold flash over nickel contact plating, which provides a contact resistance typically below 20 mΩ and excellent corrosion resistance for dry-circuit signal applications. Gold plating is important for low-voltage logic signals below 1 V where oxide layers on tin contacts could introduce millivolt-level voltage drops that affect signal integrity.
For a 60-pin FPGA breakout board, why choose TSM-130-04-FM-DH-A-P-TR over a 2-row 2.00 mm pitch alternative?
TSM-130-04-FM-DH-A-P-TR at 0.100" (2.54 mm) pitch is preferred over 2.00 mm pitch alternatives when the mating connector or probe interface is standardized on the 2.54 mm grid, as it avoids pitch-adapter boards that add up to 10 mm of stack height and additional signal stub length. The 2.54 mm grid also accommodates standard 0.100" pitch test probes and debugging clip leads used in FPGA development workflows, reducing the need for custom probe fixtures.
Is TSM-130-04-FM-DH-A-P-TR available in tape-and-reel and what production volume does it suit?
Yes, the -TR suffix confirms TSM-130-04-FM-DH-A-P-TR ships in tape-and-reel format, supporting automated SMT pick-and-place assembly at production volumes typically starting from 500 to 1,000 units per run. For prototype quantities below 50 units where tape-and-reel reloading cost is impractical, SAMTEC often offers the same connector in tray or cut-strip packaging under a modified suffix, so verifying packaging options at time of order is recommended.
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