TSM-130-03-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
The TSM-130-03-L-DH-A-K-TR is a 60-position dual-row surface-mount terminal strip from SAMTEC with a 0.100" (2.54 mm) pitch and low-profile right-angle lead style. Its dual-row SMT construction delivers high-density board interconnect for industrial control, embedded computing, and telecommunications boards, supplied in tape-and-reel packaging for automated assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TSM-130-03-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-03-L-DH-A-K-TR?
- 60 positions in dual-row arrangement at 0.100" (2.54 mm) pitch, maximizing pin density on a standard footprint
- Right-angle (L) lead style enables horizontal board-to-board or panel connection with low vertical clearance
- Surface-mount termination compatible with standard reflow soldering for high-volume automated PCB assembly
- Tape-and-reel (-TR) packaging for efficient, high-throughput pick-and-place production runs
- Dual-in-line header (DH) style compatible with standard 0.100" dual-row female connectors and sockets
What is TSM-130-03-L-DH-A-K-TR used for?
The TSM-130-03-L-DH-A-K-TR is designed for edge-mounted interconnection in embedded computing, industrial automation, and test-and-measurement boards where a right-angle 60-pin dual-row header at 0.100" pitch is required. Its surface-mount right-angle configuration suits applications where vertical board clearance is limited, such as flat-pack controller modules, panel-mount PCB assemblies, and stacked daughter-card systems requiring horizontal mating.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-03-L-DH-A-K-TR datasheet?
TSM-130-03-L-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-03-L-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the right-angle lead style of TSM-130-03-L-DH-A-K-TR differ from a vertical straight-pin version for panel-mount applications?
The right-angle (L) termination on TSM-130-03-L-DH-A-K-TR routes 60 pins parallel to the PCB surface, allowing the mating connector to engage horizontally from the board edge. This reduces the vertical height stack by up to 10 mm compared to a vertical-pin version, making it the preferred choice for flat enclosures, panel cutouts, and stacked-board assemblies where a 0.100" pitch dual-row header must not exceed a strict height limit.
What connector family mates with the dual-in-line header format of TSM-130-03-L-DH-A-K-TR?
The DH (dual-row header) footprint accepts standard 0.100" pitch dual-row female receptacles with 60 positions arranged in 2 rows of 30. Compatible SAMTEC mating connectors include SSW and SSQ series sockets, which apply approximately 90 g per pin of normal force, ensuring stable contact resistance below 20 mΩ across the full 60-position interface.
How does tape-and-reel packaging affect procurement lead time and minimum order quantity for TSM-130-03-L-DH-A-K-TR?
The -TR suffix confirms tape-and-reel delivery, which SAMTEC typically ships on standard reels of 250 or 500 pieces, aligning with SMT line minimum feed quantities. For buyers ordering at production volumes above 1,000 pieces, reel packaging reduces per-unit handling cost and eliminates tube-to-feeder transfer time, shortening assembly cycle time for boards carrying 60-position dual-row SMT headers.
What current rating should engineers assume per pin when routing power through TSM-130-03-L-DH-A-K-TR in a 48 V distributed power bus?
SAMTEC TSM series contacts rated at 0.100" pitch typically carry 1 A per pin as a conservative design rule for signal and power sharing. For a 48 V distributed bus, designers commonly dedicate multiple adjacent pins in parallel to carry higher currents, for example 5 pins in parallel for 5 A, keeping individual pin dissipation within the connector's rated thermal envelope at the given ambient temperature.
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