TSM-130-03-FM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-03-FM-DH-A-P-TR is a 60-position dual-row .100" pitch surface mount terminal strip with gold-plated contacts. Features SMT mounting, through-hole tails, and reliable 2.54 mm grid spacing for board-to-board connectivity.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-03-FM-DH-A-P-TR?
- 60 positions (2×30) on a .100" (2.54 mm) pitch dual-row configuration for high-density SMT connections
- Gold-plated contact finish for enhanced corrosion resistance and reliable electrical conductivity
- Surface mount with press-fit tails enabling automated board assembly and robust mechanical retention
What is TSM-130-03-FM-DH-A-P-TR used for?
TSM-130-03-FM-DH-A-P-TR is designed for high-density board-to-board and wire-to-board interconnection in industrial control systems, test and measurement equipment, and embedded computing modules. Its 60-position dual-row layout and .100" pitch make it ideal for backplane assemblies and expansion card interfaces where space-efficient, reliable signal routing is required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-03-FM-DH-A-P-TR datasheet?
TSM-130-03-FM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-03-FM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the TSM-130-03-FM-DH-A-P-TR connector?
The TSM-130-03-FM-DH-A-P-TR features a .100" (2.54 mm) pitch dual-row layout with 60 positions total (2×30 per row), providing a compact and high-density interconnect footprint suitable for SMT board assemblies.
Which industrial or embedded system designs benefit most from using TSM-130-03-FM-DH-A-P-TR?
This 60-position, 2.54 mm pitch terminal strip is well suited for backplane interconnects, industrial I/O expansion boards, and test fixture interfaces where 60 signals must be routed reliably across a surface-mount joint rated for standard PCB reflow processes.
How does the gold-plated contact finish of TSM-130-03-FM-DH-A-P-TR affect long-term reliability?
Gold plating provides a minimum 30 µin (0.76 µm) surface layer that resists oxidation across extended operating temperature ranges of -55°C to +125°C, maintaining contact resistance below 20 mΩ even after 500 mating cycles.
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