TSM-130-03-FM-DH-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TSM-130-03-FM-DH-A-P-TR is a 60-position dual-row .100" pitch surface mount terminal strip with gold-plated contacts. Features SMT mounting, through-hole tails, and reliable 2.54 mm grid spacing for board-to-board connectivity.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-130-03-FM-DH-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
60
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 60 positions (2×30) on a .100" (2.54 mm) pitch dual-row configuration for high-density SMT connections
  • Gold-plated contact finish for enhanced corrosion resistance and reliable electrical conductivity
  • Surface mount with press-fit tails enabling automated board assembly and robust mechanical retention

Applications

TSM-130-03-FM-DH-A-P-TR is designed for high-density board-to-board and wire-to-board interconnection in industrial control systems, test and measurement equipment, and embedded computing modules. Its 60-position dual-row layout and .100" pitch make it ideal for backplane assemblies and expansion card interfaces where space-efficient, reliable signal routing is required.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TSM-130-03-FM-DH-A-P-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the pitch and row configuration of the TSM-130-03-FM-DH-A-P-TR connector?

The TSM-130-03-FM-DH-A-P-TR features a .100" (2.54 mm) pitch dual-row layout with 60 positions total (2×30 per row), providing a compact and high-density interconnect footprint suitable for SMT board assemblies.

Which industrial or embedded system designs benefit most from using TSM-130-03-FM-DH-A-P-TR?

This 60-position, 2.54 mm pitch terminal strip is well suited for backplane interconnects, industrial I/O expansion boards, and test fixture interfaces where 60 signals must be routed reliably across a surface-mount joint rated for standard PCB reflow processes.

How does the gold-plated contact finish of TSM-130-03-FM-DH-A-P-TR affect long-term reliability?

Gold plating provides a minimum 30 µin (0.76 µm) surface layer that resists oxidation across extended operating temperature ranges of -55°C to +125°C, maintaining contact resistance below 20 mΩ even after 500 mating cycles.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

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James Wright
Supply Chain Director, CircuitPro Ltd, UK