TSM-130-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-03-F-DH-A-K-TR is a 60-position, dual-row 0.100" pitch surface mount terminal strip with flat contacts and gold plating. Features high pin-count connectivity for backplane and board-to-board SMT applications requiring reliable signal integrity. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TSM-130-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-130-03-F-DH-A-K-TR?
- 60 positions in dual-row 0.100" (2.54 mm) pitch offering high pin-count board-to-board connectivity on a single SMT footprint
- Flat (F) contact profile providing a low-profile mating surface that minimizes clearance requirements above the PCB
- Gold-plated contacts (K option) ensuring contact resistance below 20 milliohms and stable performance over -55°C to +125°C temperature range
What is TSM-130-03-F-DH-A-K-TR used for?
The TSM-130-03-F-DH-A-K-TR is ideal for high pin-count board-to-board and wire-to-board interconnections in industrial backplane systems, embedded computing modules, and data acquisition cards requiring 60 signal channels at 2.54 mm pitch. Its dual-row SMT flat-contact design is suited for automated PCB assembly in communications switching equipment, programmable logic controller interfaces, and instrumentation modules. Gold-plated contacts ensure long-term reliability in field-deployed equipment operating in thermally demanding environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-130-03-F-DH-A-K-TR datasheet?
TSM-130-03-F-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-130-03-F-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the flat (F) contact option mean for the TSM-130-03-F-DH-A-K-TR and how does it differ from other contact profiles?
The F designation in TSM-130-03-F-DH-A-K-TR specifies a flat contact profile, meaning the contact tip sits flush or nearly flush with the top surface of the connector body rather than extending significantly above it. This reduces the connector's total stack height above the PCB by approximately 1 mm to 2 mm compared to high-profile options, benefiting designs with tight component clearance constraints on the mating board.
For a 60-channel embedded processor board, what PCB footprint does the TSM-130-03-F-DH-A-K-TR occupy?
The TSM-130-03-F-DH-A-K-TR with 60 positions in 2 rows at 0.100" (2.54 mm) pitch occupies a contact field of approximately 76.2 mm x 5.08 mm (30 positions per row at 2.54 mm spacing). This dual-row layout concentrates 60 signal connections into a footprint roughly half the length required by a single-row 60-pin 2.54 mm connector, supporting compact embedded processor and FPGA board designs.
How does the TSM-130-03-F-DH-A-K-TR compare to the SFM-130-L2-F-D-A-K for high-density interconnect designs?
The TSM-130-03-F-DH-A-K-TR uses a 0.100" (2.54 mm) pitch across 60 positions, while the SFM-130-L2-F-D-A-K uses a finer 0.050" (1.27 mm) pitch for the same 60-position count. The TSM-130 is preferred where standard 2.54 mm tooling and hand assembly are required, whereas the SFM-130 is selected for ultra-high-density designs needing half the PCB footprint, such as FMC mezzanine cards and compact avionics modules.
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