TSM-130-02-TM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-130-02-TM-DH-A-P-TR is a 60-position dual-row .100" pitch surface mount terminal strip connector with 2mm stacking height. Features gold-plated contacts for reliable signal integrity and low insertion force. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row .100" (2.54 mm) pitch surface mount terminal strip for high-density board-to-board connections
- Gold-plated contacts ensure low contact resistance and reliable signal integrity over thousands of mating cycles
- Surface mount termination style simplifies PCB assembly and enables compact, space-efficient designs
Applications
The TSM-130-02-TM-DH-A-P-TR is well suited for high-density PCB-to-PCB interconnects in telecom, industrial control, and embedded computing systems where a 60-position dual-row .100" pitch connector is required. Its surface mount termination style makes it ideal for automated SMT assembly lines handling compact motherboards, backplane systems, and modular electronics requiring reliable 60-pin connectivity at 2.54 mm pitch.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the TSM-130-02-TM-DH-A-P-TR connector?
The TSM-130-02-TM-DH-A-P-TR uses a .100" (2.54 mm) pitch with a dual-row configuration providing 30 positions per row for a total of 60 positions, making it suitable for high-density PCB interconnects.
Which PCB assembly processes are compatible with the TSM-130-02-TM-DH-A-P-TR termination style?
This connector features a surface mount (SM) termination style compatible with standard SMT reflow processes. The TM suffix indicates a top-mount orientation, enabling automated placement on PCB assembly lines with reflow oven temperatures typically up to 260°C.
When would the TSM-130-02-TM-DH-A-P-TR be selected over a through-hole dual-row connector?
Engineers select TSM-130-02-TM-DH-A-P-TR over through-hole alternatives when minimizing board height and enabling automated SMT pick-and-place assembly is critical. At 60 positions and .100" (2.54 mm) pitch, it reduces PCB footprint by eliminating through-hole drilling on boards where component density is high.
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