TSM-129-05-TL-SH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-05-TL-SH-P-TR is a 29-position dual-row surface mount terminal strip at 0.100" pitch with single-row vertical orientation and tape-and-reel packaging for automated assembly. It offers reliable PCB-mount connectivity for dense board layouts requiring 29 contacts in a compact footprint. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 29
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-05-TL-SH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-129-05-TL-SH-P-TR?
- 29-position dual-row 0.100" pitch surface mount terminal strip optimized for high-density PCB interconnect
- Single-row vertical orientation with tape-and-reel packaging enabling high-volume automated pick-and-place assembly
- Shrouded housing design reduces mismating risk during cable or board mating in production environments
What is TSM-129-05-TL-SH-P-TR used for?
The TSM-129-05-TL-SH-P-TR is ideal for high-density signal interconnects on embedded control boards, industrial I/O modules, and communication backplane assemblies requiring 29 positions at 0.100" pitch. Its surface mount footprint with tape-and-reel packaging supports automated PCB assembly lines, reducing placement time and improving yield in medium-to-high volume production runs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-129-05-TL-SH-P-TR datasheet?
TSM-129-05-TL-SH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-129-05-TL-SH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.100" pitch and 29-position dual-row layout of the TSM-129-05-TL-SH-P-TR support high-density board designs?
The 0.100" (2.54 mm) pitch keeps the connector footprint compact while accommodating 29 contacts across dual rows, enabling designers to route 58 total signal or power lines through a single surface mount component. This is advantageous for industrial I/O cards and embedded SOM carrier boards where connector density directly limits available routing channels.
What assembly advantages does the tape-and-reel packaging of the TSM-129-05-TL-SH-P-TR provide for production environments?
Tape-and-reel (TR) packaging makes the TSM-129-05-TL-SH-P-TR compatible with standard SMT pick-and-place machines, eliminating manual tube or tray handling. For production runs of hundreds or thousands of boards, automated placement reduces per-unit assembly cost and maintains consistent 29-position placement accuracy compared to hand-soldering.
In what scenarios would an engineer choose the TSM-129-05-TL-SH-P-TR over a through-hole terminal strip for a backplane application?
Surface mount placement allows the TSM-129-05-TL-SH-P-TR to be mounted on either side of the PCB and eliminates the need for drilled through-holes, which preserves inner-layer routing space. For backplanes carrying 29 or more signal lines, this SMT approach also supports finer board thicknesses and reduces mechanical stress on plated-through-holes during thermal cycling.
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