TSM-129-04-T-DH-P-TR SAMTEC Connector (Other) In Stock
Samtec TSM-129-04-T-DH-P-TR is a 58-position single-row surface-mount terminal strip with 0.100-inch pitch, dual-height (DH) body, and tape-and-reel packaging for automated SMT production. Designed for reliable high-density signal routing on PCBs. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-04-T-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-129-04-T-DH-P-TR?
- 58-position single-row SMT terminal strip at 0.100-inch pitch for high pin-count signal distribution in compact PCB assemblies
- Dual-height (DH) body providing additional vertical clearance to accommodate mating connectors with varying board-to-board spacing
- Tape-and-reel (TR) packaging enabling efficient automated pick-and-place SMT assembly in high-volume PCB production environments
What is TSM-129-04-T-DH-P-TR used for?
The TSM-129-04-T-DH-P-TR is designed for surface-mount signal distribution in embedded computing, industrial controllers, and telecommunications hardware where 58-position connectivity at 0.100-inch pitch is required. The dual-height body allows the connector to interface with mating parts on boards separated by a defined standoff in multi-board stacking assemblies. Tape-and-reel packaging ensures consistent automated placement in high-throughput SMT manufacturing lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-129-04-T-DH-P-TR datasheet?
TSM-129-04-T-DH-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-129-04-T-DH-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-129-04-T-DH-P-TR provide, and what mounting method does it use?
The TSM-129-04-T-DH-P-TR provides 58 positions in a single-row surface-mount configuration at 0.100-inch (2.54 mm) pitch. It mounts via SMT reflow soldering, making it suitable for automated PCB assembly without through-hole drilling requirements in high-density signal distribution designs.
What board stacking scenarios benefit from the dual-height body of the TSM-129-04-T-DH-P-TR?
The dual-height (DH) body is particularly useful in mezzanine card designs, FPGA expansion boards, and modular industrial systems where the 58-position connector must bridge a specific inter-board gap. The elevated DH profile supports PCB stacking configurations with 4 mm or greater board-to-board spacing without requiring custom standoffs.
When is the TSM-129-04-T-DH-P-TR a better choice than a 60-position variant such as TSM-130?
Designers choose the 58-position TSM-129 series when the circuit requires fewer than 60 signal lines, reducing unnecessary pin count and simplifying PCB routing. Both the TSM-129 and TSM-130 families share the 0.100-inch pitch dual-height SMT body, so reducing to 58 positions saves routing congestion on dense PCBs without changing the physical assembly process.
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