TSM-129-03-TL-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-03-TL-DH-A-P-TR is a 58-position dual-row surface mount terminal strip with 0.100 inch pitch and through-hole tail configuration. Provides reliable high-density board-to-board and wire-to-board connectivity with SMT placement and mechanical anchoring. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-129-03-TL-DH-A-P-TR?
- 58-position dual-row layout at 0.100 inch pitch enables high-density signal distribution in a single compact SMT connector
- Through-hole tail (TL) design provides superior mechanical retention for the 58-pin connector under mating and vibration loads
- RoHS-compliant dual-row architecture compatible with standard 2.54 mm grid PCB designs for broad mating header interoperability
What is TSM-129-03-TL-DH-A-P-TR used for?
The TSM-129-03-TL-DH-A-P-TR is used in embedded computing boards, industrial controllers, and telecommunications equipment where 58-pin high-density connections at 0.100 inch pitch are required with the mechanical stability of through-hole anchoring in an SMT package. Its dual-row configuration allows compact signal routing for bus interfaces, FPGA I/O breakout boards, and multi-function daughtercards mounted in vibration-prone environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-129-03-TL-DH-A-P-TR datasheet?
TSM-129-03-TL-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-129-03-TL-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact count and pitch of the TSM-129-03-TL-DH-A-P-TR and how does it help with dense PCB routing?
The TSM-129-03-TL-DH-A-P-TR has 58 positions arranged in 2 rows at 0.100 inch (2.54 mm) pitch, giving 29 pins per row. The dual-row 0.100 inch layout fits within a narrow board-edge footprint while supporting up to a 58-line bus or mixed signal-and-power interface in a single connector, reducing the number of separate connectors needed on a dense PCB.
Why does the through-hole tail on the TSM-129-03-TL-DH-A-P-TR provide better mechanical retention than a pure SMT version?
The through-hole tails on the TSM-129-03-TL-DH-A-P-TR extend through the PCB and are soldered on the back side, creating a mechanical lock that resists the pullout and shear forces generated when mating or unmating a 58-position connector. In contrast, a surface-only SMT termination relies solely on solder joint area, which can delaminate under repeated connector cycling or board vibration in industrial environments.
For a 50-signal-line parallel interface design, is the TSM-129-03-TL-DH-A-P-TR a lower-complexity option than using multiple smaller connectors?
Yes, a single TSM-129-03-TL-DH-A-P-TR with 58 positions at 0.100 inch pitch accommodates a 50-line bus with 8 spare contacts for power, ground, or future expansion in one PCB footprint. Using multiple smaller connectors would require 3 or more individual headers, additional PCB real estate, separate placement operations, and more complex cable management, all of which the 58-pin single connector eliminates.
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