TSM-129-03-SM-SH-A SAMTEC Connector (Other) In Stock
The TSM-129-03-SM-SH-A is a 29-position dual-row surface mount terminal strip from SAMTEC with a 0.100" (2.54 mm) pitch in a horizontal single-row orientation. It provides gold-plated contacts for reliable board-to-board signal connections. Suited for prototyping, test interfaces, and compact SMT PCB designs requiring 58 total contact positions.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 29
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-03-SM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 29 positions per row in a dual-row 0.100" (2.54 mm) pitch layout, delivering 58 total contacts in a single horizontal SMT package
- Surface mount horizontal termination style enables low-profile board-to-board connections compatible with standard SMT reflow assembly
- Gold-plated pin contacts provide low contact resistance and high cycle reliability for test and prototyping interface applications
Applications
The TSM-129-03-SM-SH-A is used in board-to-board and board-to-wire signal interfaces in development platforms, evaluation boards, and rack-mount test equipment where a 58-contact horizontal SMT connector is needed. Its 0.100" (2.54 mm) pitch dual-row layout is compatible with standard 0.1" grid PCB footprints, making it straightforward to integrate into existing designs. Engineers also use it as a mating receptacle for SAMTEC SSM or SSW header series in compact industrial control modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does the TSM-129-03-SM-SH-A provide, and what is its pin pitch?
The TSM-129-03-SM-SH-A provides 29 positions per row in a dual-row layout, totaling 58 contact positions on a 0.100" (2.54 mm) pitch. This dual-row 0.1" grid format is compatible with standard prototyping and evaluation board footprints used in embedded system development.
Which SAMTEC series headers mate with the TSM-129-03-SM-SH-A for reliable board-to-board connections?
The TSM-129-03-SM-SH-A is designed to mate with SAMTEC SSM, SSW, and TSM header series that share the 0.100" (2.54 mm) pitch dual-row geometry. This compatibility allows designers to build 58-contact signal paths between PCBs in development kits and embedded computing modules.
What SMT assembly profile is recommended for the TSM-129-03-SM-SH-A?
The TSM-129-03-SM-SH-A supports standard lead-free SMT reflow assembly with a peak reflow temperature of up to 260°C. Its horizontal orientation and 0.100" (2.54 mm) pitch pads allow automated pick-and-place placement, and paste stencil printing for 58 pads requires careful alignment to prevent solder bridging on the dual-row layout.
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