TSM-129-03-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-03-H-DH-A-P-TR is a 58-position, .100" pitch dual-row surface mount terminal strip connector with 3-row height and press-fit retention, ideal for high-density PCB interconnects in industrial embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-03-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58 positions with .100" (2.54 mm) pitch for high-density dual-row board connectivity
- 3-row height (03) variant providing additional clearance for component stacking
- Press-fit (P) retention for secure mechanical positioning during reflow soldering
- Tape-and-reel (TR) packaging for automated SMT pick-and-place production
- RoHS-compliant materials supporting green electronics manufacturing requirements
Applications
The TSM-129-03-H-DH-A-P-TR is used in industrial control systems, embedded computing backplanes, and test and measurement equipment where 58-position dual-row .100" pitch interconnects are required. Its press-fit retention and tape-and-reel packaging support high-volume automated SMT assembly with precise connector positioning.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TSM-129-03-H-DH-A-P-TR support and what row configuration does it use?
The TSM-129-03-H-DH-A-P-TR provides 58 positions in a dual-row configuration with .100" (2.54 mm) pitch. This arrangement accommodates up to 58 individual signal or power connections in a compact PCB footprint, making it suitable for industrial control and embedded computing applications.
What role does the press-fit (P) retention feature play during SMT assembly of the TSM-129-03-H-DH-A-P-TR?
The press-fit retention feature mechanically secures the TSM-129-03-H-DH-A-P-TR to the PCB board surface before and during reflow soldering, preventing movement or misalignment of the 58-position, 2.54 mm pitch connector. This improves placement consistency in automated SMT production and ensures correct solder joint formation across all contact positions.
What alternative SAMTEC TSM series connectors should a designer evaluate when the 58-position count of TSM-129-03-H-DH-A-P-TR exceeds requirements?
Designers needing fewer than 58 positions at .100" (2.54 mm) dual-row pitch may consider SAMTEC TSM-103 (6 positions), TSM-120 (40 positions), or TSM-125 (50 positions) variants. Selecting a lower-position count in the TSM series reduces connector length and PCB real estate while maintaining the same 2.54 mm pitch standard and SMT assembly process.
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