TSM-129-02-STL-SH-A SAMTEC Connector (Other) In Stock
The TSM-129-02-STL-SH-A is a 58-position (29 per row) dual-row surface-mount terminal strip from Samtec with 0.100" (2.54 mm) pitch in a horizontal profile configuration. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 29
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-02-STL-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-129-02-STL-SH-A?
- 58-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch for high signal density in a horizontal profile
- Surface-mount (SMT) termination enables reflow soldering for automated PCB assembly with consistent solder joint quality
- Horizontal single-row cable exit orientation reduces vertical height above the PCB for space-constrained board designs
What is TSM-129-02-STL-SH-A used for?
The TSM-129-02-STL-SH-A is ideal for embedded computing boards, instrumentation panels, and industrial control systems where a high-position-count surface-mount connector must maintain a low board profile. Its dual-row 0.100" pitch layout accommodates dense signal routing while the horizontal mating direction suits edge-accessible board installations inside compact enclosures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-129-02-STL-SH-A datasheet?
TSM-129-02-STL-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-129-02-STL-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total positions does the TSM-129-02-STL-SH-A provide and how are they arranged?
The TSM-129-02-STL-SH-A has 58 total positions arranged in a dual-row configuration with 29 pins per row at a 0.100" (2.54 mm) pitch. This high-density layout enables routing of 58 independent signal lines from a single SMT footprint, reducing PCB area compared to using two separate 29-pin single-row connectors.
What soldering process is compatible with the TSM-129-02-STL-SH-A and what solder pad pattern does it require?
The TSM-129-02-STL-SH-A is designed for surface-mount reflow soldering, compatible with standard lead-free SAC305 solder paste at peak reflow temperatures up to 260°C. The dual-row SMT footprint requires two parallel rows of 29 solder pads each at 0.100" (2.54 mm) spacing, as specified in Samtec's recommended land pattern documentation for the TSM series.
Why choose the horizontal (-SH) configuration of TSM-129-02-STL-SH-A over a vertical mating orientation?
The -SH horizontal mating variant allows mating cable or board connectors to insert parallel to the PCB surface rather than perpendicular, reducing the combined height of the connector plus mated assembly by several millimeters. This is advantageous in low-profile enclosures or stacked PCB assemblies where vertical clearance above the board is limited to less than 15 mm.
What cable or board connectors mate with the TSM-129-02-STL-SH-A from the Samtec ecosystem?
The TSM series is designed to mate with Samtec's SSM or SSW series socket strip connectors using the standard 0.100" (2.54 mm) dual-row pitch, supporting both free-hanging cable assemblies and board-to-board stacking configurations. Compatible 58-position mating sockets accept 28 AWG discrete wire or ribbon cable jumpers widely available as pre-terminated assemblies from Samtec and third-party manufacturers.
How does TSM-129-02-STL-SH-A compare to through-hole alternatives for high-volume assembly?
The SMT configuration of the TSM-129-02-STL-SH-A eliminates 58 drilled holes per connector, saving PCB fabrication cost of approximately 0.05 to 0.10 USD per hole in volume production and freeing routing layers on inner layers that would otherwise be blocked by through-hole vias. Automated reflow also gives more consistent solder joint quality across 58 positions compared to wave soldering of through-hole connectors in high-volume builds.
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