TSM-129-02-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-02-SM-DH-A-P-TR is a 58-position, dual-row, .100" pitch surface mount terminal strip with gold-plated contacts rated at 3A per pin. Suited for dense signal and power interconnects with an operating range of -55°C to +125°C. Available from global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58-position dual-row .100" pitch surface mount layout supporting broad signal bus interconnects on standard PCB grids
- 3A per pin current rating with gold-plated contacts ensuring low resistance and reliable electrical performance
- -55°C to +125°C operating temperature range covering harsh industrial and automotive environments
Applications
The TSM-129-02-SM-DH-A-P-TR serves industrial control panels, robotics, and embedded computing systems requiring a 58-pin board-to-board interface. Its dual-row .100" pitch is compatible with standard PCB design rules, and the 3A per pin rating supports mixed signal and power routing within a single connector.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What bus width does the TSM-129-02-SM-DH-A-P-TR support compared to smaller TSM variants?
The TSM-129-02-SM-DH-A-P-TR provides 58 positions in a dual-row .100" pitch arrangement, offering nearly 10 times the signal count of a 6-position TSM variant, making it ideal for wide parallel buses in industrial computing and embedded control systems.
Can the TSM-129-02-SM-DH-A-P-TR handle mixed power and signal on the same connector body?
Yes. With 3A per pin current capacity and 58 available pins, designers can dedicate several pins to power rails while routing signal lines on the remaining contacts, a common practice in embedded computing and sensor hub PCB designs.
How does the surface mount footprint of TSM-129-02-SM-DH-A-P-TR benefit automated PCB assembly?
Surface mount technology eliminates the need for through-hole drilling, reducing board layer count and simplifying pick-and-place assembly. The .100" pitch aligns to standard 2.54 mm pad grids, making the TSM-129-02-SM-DH-A-P-TR directly compatible with most automated SMT assembly lines.
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