TSM-129-02-L-SH-A SAMTEC Connector (Other) In Stock

SAMTEC TSM-129-02-L-SH-A is a 58-pin (29-position, dual-row) 0.100" pitch surface-mount terminal strip with gold-over-nickel mating contacts, delivering reliable board-to-board connectivity in compact, horizontally oriented SMT assemblies.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSM-129-02-L-SH-AOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
29
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 29 positions dual-row configuration providing 58 contacts at 0.100 inch pitch for high-density board connectivity
  • Gold (10 µin) over nickel mating finish ensuring low contact resistance and corrosion resistance over thousands of mating cycles
  • Surface-mount horizontal (L) orientation with PEG board mounting option for stable solder reflow attachment

Applications

The TSM-129-02-L-SH-A is used in modular embedded computing platforms where daughter cards or mezzanine modules connect to a baseboard at 0.100 inch pitch. Its dual-row 58-contact layout provides sufficient signal and power lines for small form-factor SBCs, FPGA development modules, and test fixtures. The horizontal SMT orientation keeps the connector profile low, making it suitable for space-constrained enclosures with height limits under 10 mm.

Specifications

Pbfree CodeYes
YTEOL9.1
Board Mounting OptionPEG
Body Breadth0.12inch
Body Depth0.29inch
Body Length2.9inch
Connector TypeBOARD CONNECTOR
Contact DesignPREASSEM CONN
Contact Finish MatingGOLD (10) OVER NICKEL
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.1inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting StyleRIGHT ANGLE
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows1
Number of Rows Loaded1
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
Plating Thickness10u inch
Rated Current (Signal)7A
Reference StandardCSA; UL
Terminal Pitch2.54mm
Termination TypeSURFACE MOUNT
Total Number of Contacts29
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TSM-129-02-L-SH-A Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many usable contacts does the TSM-129-02-L-SH-A provide, and what pitch spacing should the mating connector match?

The TSM-129-02-L-SH-A has 29 positions in a dual-row arrangement, providing 58 contacts total at a 0.100 inch (2.54 mm) pitch. Any standard 0.100 inch dual-row mating connector, such as Samtec's TSW or BCS series, can be used as the receptacle, ensuring compatibility across a wide range of off-the-shelf connectors and cable assemblies.

What contact finish does the TSM-129-02-L-SH-A use, and how many mating cycles can it reliably support?

The mating contacts are finished with 10 µin of gold over a nickel barrier, and the termination side uses tin over nickel. Gold-over-nickel contact finishes typically support 500 to 1000 mating cycles while maintaining contact resistance below 20 mΩ, making this connector suitable for test fixtures and removable module applications that require repeated insertion.

In which embedded computing or prototyping applications is the TSM-129-02-L-SH-A commonly used?

This connector is widely used in FPGA mezzanine card designs, Raspberry Pi-compatible HAT connectors, and custom SBC daughter-card interfaces where 58 pins at 2.54 mm pitch provide adequate I/O expansion. The 2.9 inch body length and SMT horizontal mounting also make it a practical choice for backplane prototyping fixtures that need secure mechanical retention via the PEG option.

How does the TSM-129-02-L-SH-A surface-mount design differ from a through-hole equivalent for production assembly?

The surface-mount TSM series eliminates through-hole drilling in the PCB, reducing fabrication cost by as much as 30% on boards with 4 or more layers. Reflow soldering at 260 °C peak temperature attaches all 58 contacts simultaneously, compared with selective or wave soldering required for through-hole pins, speeding up automated assembly on standard SMT lines.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
$
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK