TSM-129-01-TL-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-01-TL-DH-A-P-TR is a 58-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, offering reliable multi-signal board-to-board connectivity with tape-and-reel packaging for automated SMT production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58-position dual-row terminal strip at 0.100" (2.54 mm) pitch for high signal count SMT board interconnect
- Surface mount termination enables integration into standard pick-and-place and reflow soldering workflows
- Tape-and-reel (TR suffix) packaging supports automated high-volume SMT assembly with minimal manual handling
- Dual-row contact arrangement maximizes channel density within a compact PCB footprint
- Gold-plated contacts provide low contact resistance and durability for demanding interconnect applications
- Suitable for industrial, communications, and embedded computing platforms requiring 58-channel interfaces
Applications
The TSM-129-01-TL-DH-A-P-TR is designed for high-density board-to-board interconnect in FPGA development boards, industrial I/O modules, and embedded single-board computers requiring 58 signal channels in a surface mount format. Tape-and-reel packaging and 0.100 inch pitch dual-row layout make it efficient for automated production of telecommunications and data acquisition equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-129-01-TL-DH-A-P-TR support, and at what spacing?
TSM-129-01-TL-DH-A-P-TR provides 58 positions at 0.100 inch (2.54 mm) pitch in a dual-row layout. This contact count is suited for high-channel-count interfaces such as FPGA I/O breakout, industrial data acquisition boards, and multi-card backplane interconnects where 58 signals must be routed through a single surface mount connector.
How does the tape-and-reel packaging of TSM-129-01-TL-DH-A-P-TR support automated assembly?
The TR suffix designates tape-and-reel packaging, which feeds directly into standard pick-and-place machines used in SMT lines. This eliminates manual component loading, reduces placement errors for the 58-position dual-row footprint, and supports reflow soldering at typical peak temperatures around 260°C for efficient high-volume production.
What is the difference in application fit between TSM-129-01-TL-DH-A-P-TR and a similar 56-position SAMTEC strip?
TSM-129-01-TL-DH-A-P-TR provides 58 positions versus a 56-position variant, offering 2 additional signal lines. These extra contacts can be assigned to supplementary control, power, or ground signals without adding a second connector. For designs requiring exactly 58 channels at 0.100 inch pitch, this variant avoids unused pin positions and reduces connector count.
Is TSM-129-01-TL-DH-A-P-TR compatible with standard RoHS lead-free assembly requirements?
SAMTEC TSM-series surface mount terminal strips are generally produced with RoHS-compliant, lead-free materials. The tin-plated termination finish is compatible with lead-free solder alloys and reflow profiles used in RoHS-compliant SMT assembly, making this 58-position connector suitable for designs targeting EU RoHS directives and similar global compliance requirements.
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