TSM-129-01-S-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-129-01-S-DH-A-P-TR is a 58-position dual-row surface-mount terminal strip on 0.100" (2.54 mm) pitch, featuring straight SMT leads, gold-plated contacts, and tape-and-reel packaging for high-density board-to-board interconnect in automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- TSM-129-01-S-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58 total contact positions in dual-row (DH) layout on 0.100" (2.54 mm) pitch for dense interconnect
- Gold-plated (-P) contacts offering low contact resistance and extended mating cycle life
- Tape-and-reel (-TR) packaging for automated SMT pick-and-place assembly at volume
- Straight SMT (-S) leads compatible with standard reflow soldering processes up to 260°C
- RoHS-compliant construction meeting lead-free manufacturing requirements
Applications
The TSM-129-01-S-DH-A-P-TR is designed for high-density board-to-board and module-to-baseboard interconnect in embedded computing platforms, industrial control systems, and telecom equipment. Its 58-pin dual-row arrangement with straight SMT leads and gold-plated contacts provides reliable electrical connection with low contact resistance for signal routing in backplane and plug-in module applications requiring multiple mating cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and row configuration does TSM-129-01-S-DH-A-P-TR provide for board-level interconnect?
TSM-129-01-S-DH-A-P-TR provides 58 contact positions arranged in 2 rows on a 0.100 inch (2.54 mm) pitch, enabling high-density signal routing across module boundaries in embedded computing, backplane, and industrial control PCB designs.
How does the straight SMT lead style (-S) on TSM-129-01-S-DH-A-P-TR compare to through-hole variants for assembly efficiency?
Straight SMT leads allow the 58-pin connector to be reflowed with other surface-mount components in a single oven pass at temperatures up to 260°C, eliminating the separate wave solder step required for through-hole variants and reducing total assembly cost on mixed-technology boards.
What contact plating and resistance level should design engineers expect from TSM-129-01-S-DH-A-P-TR?
The -P suffix designates gold-plated contacts, which provide stable contact resistance below 20 mΩ and resist oxidation over more than 100 mating cycles. Gold plating is preferred over tin for designs where signal integrity and long-term reliability across plug-in module swaps are critical requirements.
How does tape-and-reel packaging affect minimum order quantities and inventory planning for TSM-129-01-S-DH-A-P-TR?
EIA-481 tape-and-reel (-TR) packaging is supplied in reels typically holding 500 pieces of this 58-pin dual-row connector. Buyers planning production runs under 500 units may request cut-tape quantities at a premium, while volume programs should order full reels to minimize per-unit packaging cost and simplify feeder management on the SMT line.
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