TSM-128-04-T-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-04-T-DH-A-P-TR is a 56-position, 0.100 inch pitch dual-row surface-mount terminal strip with vertical leads and tape-and-reel packaging. Dual-height design supports stacked PCB assemblies. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- TSM-128-04-T-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row configuration at 0.100 inch (2.54 mm) pitch for high-density board-to-board interconnect
- Vertical (T) lead style enables straight-down PCB mating, ideal for parallel stacked board assemblies
- Tape-and-reel (TR) packaging ensures compatibility with automated SMT pick-and-place production lines
- Dual-height (DH) design provides defined standoff between mated boards for thermal and mechanical clearance
Applications
The TSM-128-04-T-DH-A-P-TR is designed for high-density board-to-board signal interconnect in stacked PCB assemblies such as backplane modules, industrial computing cards, and embedded system expansions requiring 56 positions at a 0.100 inch pitch. The vertical lead style provides a minimal footprint suitable for parallel board stacking, while the dual-height feature maintains a controlled inter-board gap. Tape-and-reel packaging supports efficient SMT line assembly for medium-to-large production volumes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contact positions does the TSM-128-04-T-DH-A-P-TR provide, and what pitch is used?
The TSM-128-04-T-DH-A-P-TR provides 56 positions arranged in 2 rows of 28 contacts each, at a standard 0.100 inch (2.54 mm) pitch. This widely used pitch ensures broad compatibility with complementary mating headers from SAMTEC and other manufacturers, and is common in backplane and stacked PCB board-to-board connections.
What advantage does the dual-height (DH) feature offer in stacked PCB designs using the TSM-128-04-T-DH-A-P-TR?
The dual-height (DH) design maintains a precise and consistent inter-board spacing when the TSM-128-04-T-DH-A-P-TR is mated with a complementary connector. This defined standoff distance, typically several millimeters, allows adequate airflow for thermal management between boards and prevents mechanical interference between components on adjacent PCBs in a stacked assembly.
Is the TSM-128-04-T-DH-A-P-TR suitable for automated production, and what ordering quantity is typical for reel?
Yes, the tape-and-reel (TR) packaging of the TSM-128-04-T-DH-A-P-TR is specifically designed for automated pick-and-place machines on SMT assembly lines. Reels typically contain quantities of 500 or more units per reel, enabling efficient high-volume production while reducing manual handling of the 56-pin connector and minimizing placement errors during automated board assembly.
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