TSM-128-04-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-04-SM-DH-A-P-TR is a 56-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, designed for reliable high-density board-to-board interconnect with gold-plated contacts and standard SMT compatibility.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row layout at 0.100" (2.54 mm) pitch for high-density SMT board interconnect
- Gold-plated mating contacts deliver low contact resistance and long-term corrosion resistance
- Surface mount termination compatible with pick-and-place and standard reflow soldering processes
- Dual-row design provides high signal count in a compact PCB footprint
- Tape-and-reel packaging (TR suffix) supports automated high-volume SMT assembly
- Robust mechanical design suited for industrial, communications, and embedded computing platforms
Applications
TSM-128-04-SM-DH-A-P-TR is well suited for modular embedded computing boards, FPGA prototyping platforms, and industrial I/O expansion modules where 56 signal connections are needed in a surface mount dual-row format. The tape-and-reel packaging makes it practical for automated assembly in volume production runs across telecommunications and data acquisition equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TSM-128-04-SM-DH-A-P-TR provide and at what pitch?
The TSM-128-04-SM-DH-A-P-TR provides 56 positions arranged in a dual-row format with a 0.100 inch (2.54 mm) pitch. This configuration allows designers to route 56 individual signals across a single connector interface, making it practical for FPGA breakout boards, data acquisition systems, and modular backplane designs.
Does the tape-and-reel packaging of TSM-128-04-SM-DH-A-P-TR suit high-volume automated SMT assembly?
Yes. The TR suffix indicates tape-and-reel packaging, which is compatible with standard pick-and-place equipment and reflow soldering at typical SMT peak temperatures around 260°C. This packaging reduces manual handling and supports high-volume production runs while maintaining consistent placement accuracy for the 56-position footprint.
What are the key differences between TSM-128-04-SM-DH-A-P-TR and a comparable through-hole terminal strip?
The surface mount design of TSM-128-04-SM-DH-A-P-TR eliminates the need for drilled through-holes, reducing PCB layer stack requirements and enabling denser routing on adjacent layers. With 56 positions at 0.100 inch pitch, it occupies less board real estate than through-hole equivalents and integrates directly into standard SMT assembly lines.
For which industrial or computing applications is TSM-128-04-SM-DH-A-P-TR typically specified?
This connector is commonly specified in industrial I/O expansion cards, embedded single-board computers, and test and measurement instruments that require 56 or more signal channels on a surface mount interface. Its dual-row 0.100 inch pitch format is well established in instrumentation, robotics controllers, and FPGA development platforms needing reliable multi-pin board-to-board connections.
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