TSM-128-03-TL-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-03-TL-DH-A-P-TR is a 56-position dual-row .100" (2.54 mm) pitch surface-mount terminal strip connector with tape-and-reel packaging. Offers a shrouded dual-row layout with gold-plated contacts suited for high-density board-to-board SMT interconnects in industrial and embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row surface-mount terminal strip on .100" (2.54 mm) pitch
- Tape-and-reel (TR) packaging for high-throughput automated SMT assembly
- Shrouded dual-row housing for mechanical keying and mating guidance
- Gold-plated contacts ensuring low contact resistance and high reliability
- High-density 28-per-row layout enabling large signal bus interconnects in compact PCB footprints
Applications
The TSM-128-03-TL-DH-A-P-TR is designed for high-density board-to-board and daughtercard interconnect applications in industrial automation, embedded computing platforms, and telecommunications backplane assemblies. With 56 positions on a dual-row 2.54 mm pitch format, it supports large parallel data buses, mixed signal-and-power configurations, and high-pin-count interface cards where SMT assembly is preferred over through-hole.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal connections does the TSM-128-03-TL-DH-A-P-TR support in a dual-row configuration?
The TSM-128-03-TL-DH-A-P-TR provides 56 total positions arranged in 2 rows of 28 pins each on a .100" (2.54 mm) pitch. This high-density layout supports 56 simultaneous signal or power connections, making it ideal for parallel bus interfaces, sensor arrays, and multi-channel power distribution in embedded system designs.
Which assembly processes are supported by TSM-128-03-TL-DH-A-P-TR, and how does its packaging help production efficiency?
This connector comes in tape-and-reel (TR) packaging, enabling automated pick-and-place SMT assembly with reflow soldering. The surface-mount termination eliminates through-hole drilling for all 56 positions, significantly reducing PCB fabrication cost and assembly cycle time in high-volume production environments handling thousands of boards per day.
How does the TSM-128-03-TL-DH-A-P-TR compare to a 56-position through-hole connector for backplane applications?
Compared to a through-hole alternative, the TSM-128-03-TL-DH-A-P-TR offers a lower PCB profile and avoids drilling 56 holes per connector, reducing board cost. Its SMT footprint also enables double-sided component placement. However, for applications requiring higher mechanical pull-out strength beyond 2 N per pin, a through-hole variant may be specified instead.
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