TSM-128-03-SM-DH-A-P-TR SAMTEC Connector (Other) In Stock
TSM-128-03-SM-DH-A-P-TR is a SAMTEC 56-position dual-row surface mount terminal strip with 2.54 mm (0.100") pitch in a low-profile SMT configuration for high-density PCB interconnection. Three-row variant supports expanded signal density without increasing board footprint width. Available from stock worldwide with reliable shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-128-03-SM-DH-A-P-TR?
- 56-position configuration at 2.54 mm (0.100 inch) pitch with 3-row spacing enables high-density signal routing in a compact SMT package
- Surface mount termination supports automated reflow soldering at up to 260°C for cost-effective high-volume PCB manufacturing
- SAMTEC TSM series precision housing construction maintains consistent contact alignment across all 56 positions for reliable digital signal integrity
What is TSM-128-03-SM-DH-A-P-TR used for?
The TSM-128-03-SM-DH-A-P-TR is used in high-density backplane interconnect systems, FPGA mezzanine card interfaces, and embedded computing platforms requiring 56-pin surface mount connectors at 2.54 mm pitch. Its three-row design distributes signal contacts across a narrow footprint, reducing board length compared to single-row alternatives. The SMT package suits automated PCB assembly in industrial electronics and communication hardware applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-128-03-SM-DH-A-P-TR datasheet?
TSM-128-03-SM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-128-03-SM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 3-row configuration of TSM-128-03-SM-DH-A-P-TR differ from a 2-row terminal strip of similar pin count?
The 3-row configuration of TSM-128-03-SM-DH-A-P-TR distributes 56 contacts across 3 rows at 2.54 mm pitch, resulting in a shorter connector body length compared to a 2-row design with equivalent pin count. This reduces PCB edge length occupied by the connector, beneficial in narrow PCB form factors with constrained board dimension.
At what reflow temperature can the TSM-128-03-SM-DH-A-P-TR be soldered during PCB assembly?
The TSM-128-03-SM-DH-A-P-TR is rated for SMT reflow soldering and can withstand peak temperatures of 260°C per standard lead-free reflow profiles per IPC J-STD-020. This allows it to be processed alongside other SMT components in a single-pass reflow oven cycle without requiring selective soldering.
Which bus interface designs can use TSM-128-03-SM-DH-A-P-TR as a mezzanine or expansion connector?
The 56-position TSM-128-03-SM-DH-A-P-TR at 2.54 mm pitch supports parallel bus interfaces with up to 56 signals, including 32-bit data buses with address lines for memory or peripheral expansion on embedded boards. Its SMT footprint fits standard 2.54 mm pad arrays commonly used in FPGA development kits and SBC expansion headers.
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