TSM-128-02-TM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-02-TM-SH-A is a 28-position dual-row surface-mount terminal strip with 2.54mm (0.100") pitch in a horizontal right-angle orientation with shroud. It delivers 56 total contacts for high-density SMD board-to-cable or board-to-board interconnection in instrumentation, computing, and industrial control PCB designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- TSM-128-02-TM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-128-02-TM-SH-A?
- 56 total contacts (28 × 2 dual-row) at 2.54mm pitch provide high-density I/O interconnection in a compact SMD footprint
- Horizontal right-angle (TM) orientation routes cables parallel to the PCB surface for low-profile enclosure installations
- Shrouded housing (SH) protects contacts from contamination and guides mating connector insertion in blind-mate scenarios
- Surface-mount termination supports reflow soldering alongside other SMD components without secondary through-hole operations
What is TSM-128-02-TM-SH-A used for?
The TSM-128-02-TM-SH-A is used on FPGA development boards, embedded computing modules, and industrial PLC backplanes where 28 dual-row signal positions are needed for ribbon cable or daughter-card connections at 2.54mm pitch. The shrouded horizontal profile allows the connector to sit flush against a chassis wall while the 56-pin count supports mixed power and signal routing in a single connector body. Its SMD construction also suits high-reliability data acquisition modules and test equipment front panels requiring robust automated assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-128-02-TM-SH-A datasheet?
TSM-128-02-TM-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-128-02-TM-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does the TSM-128-02-TM-SH-A provide, and what pitch does it use?
The TSM-128-02-TM-SH-A is a 28-position (2 × 28, 56-pin total) dual-row connector with 2.54mm (0.100-inch) center-to-center pitch. This widely adopted pitch is compatible with standard IDC ribbon cables, flat-flex adapters, and socketed daughter modules, making the connector a drop-in fit on most embedded computing and instrumentation PCB designs.
In what system designs does the TSM-128-02-TM-SH-A's horizontal right-angle shrouded orientation offer a layout advantage?
The right-angle (TM) shrouded orientation routes the mating cable parallel to the board surface, reducing connector height to less than 10mm above the PCB plane and enabling use in flat chassis enclosures or rack-mounted instruments with limited vertical clearance. The shroud provides 360° contact protection against debris and acts as a polarization key, preventing reverse or offset insertion of mating 56-pin IDC ribbon connectors.
What current and voltage limits should a designer verify when allocating mixed power and signal pins on the TSM-128-02-TM-SH-A?
SAMTEC TSM-series 2.54mm-pitch contacts are typically rated at 3A per pin at up to 250V. When using multiple adjacent pins for higher current, engineers must derate based on thermal coupling between pins: at 2A per pin across 4 contiguous power pins, the SMD solder joint temperature should be kept below 85°C to prevent solder creep, typically verified by thermal simulation or worst-case ambient testing at the system's maximum operating temperature.
How does the TSM-128-02-TM-SH-A compare to a 56-pin through-hole header for a high-volume PCB assembly process?
The SMD termination of the TSM-128-02-TM-SH-A eliminates the need for PCB through-holes and wave soldering, reducing drilling cost by approximately 56 holes per board and enabling single-pass reflow assembly. For production volumes above 1,000 units, this yields measurable savings in fabrication and assembly cycle time compared to a through-hole 56-pin DIP header, while also freeing inner PCB routing layers from via stubs beneath the connector footprint.
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