TSM-128-02-SS-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-02-SS-DH-A-P-TR is a 56-position dual-row 2.54 mm (0.100 inch) pitch surface-mount terminal strip with gold-flash contacts, polarized shrouded housing, and tape-and-reel packaging for high-volume SMT assembly. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row layout at 2.54 mm (0.100 inch) pitch enabling high-density parallel signal interconnects on standard 100-mil grid PCBs
- Gold-flash (SS) contact finish combined with a polarized (P) shrouded (DH) housing ensuring reliable mating and prevention of mis-insertion across all 56 circuits
- Tape-and-reel (TR) packaging for fully automated pick-and-place SMT assembly, supporting high-volume production with consistent placement accuracy
Applications
The SAMTEC TSM-128-02-SS-DH-A-P-TR is used in backplane interconnect, computer expansion boards, and embedded system PCBs requiring 56 signals routed through a standard 2.54 mm pitch dual-row connector. Its polarized shrouded housing prevents reverse insertion in field-replaceable module designs. The SMT footprint and tape-and-reel format make it well suited for automated high-volume manufacturing lines in telecommunications and industrial computing equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many circuits does the TSM-128-02-SS-DH-A-P-TR support and on what pitch?
The TSM-128-02-SS-DH-A-P-TR provides 56 circuits in a dual-row configuration at a 2.54 mm (0.100 inch) pitch, with 28 contacts per row. This standard 100-mil grid spacing ensures compatibility with a wide range of PCB layouts and mating cable-socket assemblies used in embedded computing and test equipment.
What does the gold-flash contact finish (SS) offer compared to tin-plated alternatives on the TSM-128-02-SS-DH-A-P-TR?
The SS gold-flash finish provides lower and more stable contact resistance than tin plating, especially in low-current signal applications below 1 A. Gold flash resists oxidation better over time, making the TSM-128-02-SS-DH-A-P-TR more reliable in environments with temperature cycling between -55 °C and +125 °C.
Does the polarized housing on the TSM-128-02-SS-DH-A-P-TR prevent incorrect mating in field applications?
Yes, the 'P' (polarized) designator means the shrouded dual-row housing has a keying feature that mechanically prevents reverse or off-center insertion of the mating connector. This is critical in 56-position assemblies where mis-mating could damage signal lines operating at up to 2 A per contact.
When is the TSM-128-02-SS-DH-A-P-TR preferable to a through-hole version for board-to-board applications?
The surface-mount version eliminates drilling of 56 through-holes, reducing PCB fabrication cost and allowing component placement on both sides of the board. SMT reflow at 260 °C peak temperature locks all 56 contacts simultaneously, versus wave-solder through-hole processes that risk uneven heat distribution across a long 2.54 mm pitch row.
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