TSM-128-02-S-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-02-S-DH-A-K-TR is a 56-position, 0.100" pitch surface mount terminal strip connector with dual-row layout, solder-tail SMT termination, and gold-plated contacts for reliable signal integrity in compact board designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- TSM-128-02-S-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row layout on 0.100" (2.54 mm) pitch for high-density board interconnects
- Surface mount SMT termination compatible with standard reflow soldering processes
- Gold-plated contacts ensuring low contact resistance and superior corrosion resistance
- Compact DH-series profile designed for space-constrained PCB applications
- Tape-and-reel (-TR) packaging for automated SMT pick-and-place assembly
Applications
The TSM-128-02-S-DH-A-K-TR is well-suited for backplane interconnects, daughtercard-to-motherboard interfaces, and high-density signal routing in industrial control and test equipment. Its 0.100" pitch dual-row configuration supports applications in data acquisition systems, communications hardware, and embedded computing boards where reliable surface mount connectivity is required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the TSM-128-02-S-DH-A-K-TR connector have?
The TSM-128-02-S-DH-A-K-TR is a 56-position connector arranged in 2 rows on a 0.100" (2.54 mm) pitch, providing 28 contacts per row for high-density signal interconnects on surface mount PCBs.
What soldering process is compatible with the TSM-128-02-S-DH-A-K-TR terminal strip?
This connector uses surface mount (SMT) solder-tail termination, making it fully compatible with standard reflow soldering at peak temperatures up to 260°C, suitable for automated PCB assembly lines using solder paste and IR or convection reflow ovens.
In which industrial or embedded computing applications is the TSM-128-02-S-DH-A-K-TR typically used?
The TSM-128-02-S-DH-A-K-TR is commonly used in backplane interconnect designs, data acquisition systems, test and measurement equipment, and industrial control boards where 56 positions on a 0.100" pitch dual-row layout are needed for compact, reliable surface mount connectivity.
What packaging format does the TSM-128-02-S-DH-A-K-TR come in for volume PCB assembly?
The -TR suffix indicates tape-and-reel packaging, enabling automated pick-and-place assembly at high volumes. Each reel contains multiple connectors precisely positioned for 0.100" pitch SMT placement on PCB pads.
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