TSM-128-02-LM-DH-A-P-TR SAMTEC Connector (Other) In Stock
TSM-128-02-LM-DH-A-P-TR is a SAMTEC 56-position dual-row surface mount terminal strip with 2.54 mm (0.100") pitch for high-density PCB signal interconnection. Low-profile SMT design supports automated assembly and stacked board configurations. Available from stock worldwide with reliable shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-128-02-LM-DH-A-P-TR?
- 56-position dual-row configuration at 2.54 mm (0.100 inch) pitch for compact high-density signal routing on PCBs
- Low-profile surface mount termination compatible with standard reflow soldering up to 260°C for automated assembly
- SAMTEC TSM series precision molded housing ensures consistent 56-pin contact alignment and reliable signal integrity
What is TSM-128-02-LM-DH-A-P-TR used for?
The TSM-128-02-LM-DH-A-P-TR is used in embedded processor boards, FPGA evaluation kits, and high-speed data acquisition systems requiring 56-pin dual-row connectivity at 2.54 mm pitch. Its low-profile SMT format makes it a preferred choice for stackable module architectures and compact enclosures. The connector supports both digital and mixed-signal applications across industrial and consumer electronics platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-128-02-LM-DH-A-P-TR datasheet?
TSM-128-02-LM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-128-02-LM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TSM-128-02-LM-DH-A-P-TR connector?
The TSM-128-02-LM-DH-A-P-TR has 56 positions arranged in 2 rows at 2.54 mm (0.100 inch) pitch, providing 28 pins per row. This dual-row layout balances high pin density with standard 2.54 mm spacing widely used in digital and mixed-signal PCB designs.
Can TSM-128-02-LM-DH-A-P-TR withstand reflow soldering temperatures used in SMT manufacturing?
Yes, the TSM-128-02-LM-DH-A-P-TR is rated for SMT reflow assembly and can withstand peak temperatures of 260°C as required by standard lead-free reflow profiles. This makes it compatible with modern automated PCB assembly equipment and IPC J-STD-020 reflow classifications.
When is TSM-128-02-LM-DH-A-P-TR preferred over a 56-position through-hole connector for board stacking?
The TSM-128-02-LM-DH-A-P-TR is preferred when board thickness and height constraints are critical, since surface mount termination eliminates the need for through-hole drilling and reduces the connector height profile by several millimeters compared to DIP alternatives. This benefit is significant in stacked module designs operating within 10 mm board-to-board clearances.
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