TSM-128-02-H-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-02-H-DH-A-P-TR is a 56-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch, designed for reliable high-density board-to-board connections with tape-and-reel packaging for automated SMT assembly lines.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- TSM-128-02-H-DH-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row surface mount terminal strip at 0.100" (2.54 mm) pitch for high channel count board interconnect
- Tape-and-reel (TR) packaging enables seamless integration into automated pick-and-place SMT assembly
- Dual-row contact configuration provides 56 signal channels in a single compact SMT connector
- Gold-plated contact finish delivers low contact resistance and reliable signal integrity across operating life
- Compatible with standard lead-free reflow soldering processes for RoHS-compliant manufacturing
- Suitable for industrial control, FPGA boards, and embedded computing requiring 56-channel SMT interfaces
Applications
The TSM-128-02-H-DH-A-P-TR is designed for board-to-board interconnect in industrial I/O expansion cards, FPGA breakout boards, and embedded computing platforms that need 56 signal channels on a 0.100 inch pitch surface mount interface. Its tape-and-reel format supports high-volume automated SMT assembly for telecommunications equipment, test instrumentation, and modular control systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and pitch does TSM-128-02-H-DH-A-P-TR use for board-to-board signal routing?
TSM-128-02-H-DH-A-P-TR provides 56 positions at 0.100 inch (2.54 mm) pitch in a dual-row surface mount layout. This allows 56 independent signal channels to be routed through a single connector, making it practical for FPGA I/O breakout, industrial data acquisition, and multi-channel embedded computing module interfaces.
How does the H variant suffix in TSM-128-02-H-DH-A-P-TR affect the connector's mechanical profile?
In SAMTEC's TSM series, the H designation typically refers to the height or standoff style of the connector above the PCB surface. This affects the mating clearance needed between boards and the overall stack height in board-to-board assemblies, with standard heights typically in the range of a few millimeters to accommodate 56-position dual-row mating interfaces.
Is TSM-128-02-H-DH-A-P-TR compatible with RoHS lead-free manufacturing processes?
Yes. SAMTEC TSM-series terminal strips are built with RoHS-compliant materials and their tin-based termination finishes are compatible with standard lead-free solder pastes and reflow profiles peaking around 260°C. This makes TSM-128-02-H-DH-A-P-TR suitable for products exported to EU, Chinese, and other regulated markets with RoHS 2 compliance requirements.
When should an engineer select TSM-128-02-H-DH-A-P-TR instead of a fine-pitch 0.050 inch alternative?
TSM-128-02-H-DH-A-P-TR at 0.100 inch (2.54 mm) pitch is preferred when the PCB design allows wider pin spacing and uses standard SMT footprint libraries, reducing the risk of solder bridging during reflow. Fine-pitch 0.050 inch connectors offer denser layouts but require tighter PCB tolerances and more precise solder paste deposition, increasing manufacturing complexity for 56-position assemblies.
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