TSM-128-01-TM-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-128-01-TM-DH-A-P-TR is a 56-position dual-row surface-mount terminal strip with 0.100 inch (2.54 mm) pitch. Designed for SMT PCB assembly with tape-and-reel packaging, it delivers reliable signal interconnect for board-stacking and high-density connector applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-128-01-TM-DH-A-P-TR?
- 56-position dual-row layout at 0.100 inch pitch delivers high-density interconnect in a compact SMT footprint
- Tape-and-reel packaging enables automated pick-and-place SMT assembly for high-volume PCB production
- Reliable terminal strip construction supports consistent mating cycles in industrial and embedded board-stacking designs
What is TSM-128-01-TM-DH-A-P-TR used for?
The TSM-128-01-TM-DH-A-P-TR is used in board-stacking and module-to-baseboard interconnect designs where 56-position dual-row connectivity at 0.100 inch pitch is required in a surface-mount configuration. It serves FPGA breakout boards, embedded computing daughter cards, and industrial control modules that need reliable multi-signal connections within a minimal PCB footprint. The tape-and-reel format allows direct integration into automated SMT assembly lines for high-volume manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-128-01-TM-DH-A-P-TR datasheet?
TSM-128-01-TM-DH-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-128-01-TM-DH-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-128-01-TM-DH-A-P-TR provide, and what is its contact pitch?
The TSM-128-01-TM-DH-A-P-TR offers 56 positions arranged in a dual-row pattern at 0.100 inch (2.54 mm) pitch. This configuration provides 56 independent signal or power contacts in two parallel rows, allowing dense board-to-board interconnect within a standard 0.100 inch grid spacing used across embedded and industrial connector systems.
Is TSM-128-01-TM-DH-A-P-TR compatible with automated SMT reflow assembly processes?
Yes, the TSM-128-01-TM-DH-A-P-TR is packaged in tape-and-reel format and features a surface-mount body that places directly onto PCB pads via pick-and-place equipment. After placement, the terminal strip is soldered using standard reflow ovens, eliminating manual insertion steps and improving positional accuracy across 56 positions at 0.100 inch pitch in high-volume production.
Which embedded module designs benefit most from using a 56-position surface-mount strip like TSM-128-01-TM-DH-A-P-TR?
FPGA development boards, system-on-module carrier boards, and industrial PLC backplanes benefit most from this 56-position 0.100 inch pitch surface-mount strip. The dual-row layout concentrates 56 signal lines in a narrow SMT footprint, reducing the PCB area needed for inter-board connectivity versus using multiple smaller connectors or through-hole headers.
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