TSM-127-04-S-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-04-S-DH-A-K-TR is a 54-position dual-row surface-mount terminal strip with 2.54 mm (0.100 inch) pitch, offering reliable board-to-board connectivity in industrial and computing designs. Key specs: 54 contacts, 2.54 mm pitch, SMT mounting. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-04-S-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-127-04-S-DH-A-K-TR?
- 54-position dual-row SMT terminal strip with 2.54 mm pitch for dense signal routing
- Surface-mount termination compatible with standard reflow soldering and pick-and-place assembly
- Tape-and-reel packaging (TR suffix) enabling high-volume automated PCB assembly
- Robust contact design rated for reliable signal integrity across hundreds of mating cycles
What is TSM-127-04-S-DH-A-K-TR used for?
The TSM-127-04-S-DH-A-K-TR is ideal for backplane interconnects, FPGA development boards, and system-on-module carrier card designs requiring 54 high-density signal connections in a 2.54 mm pitch footprint. Its surface-mount profile reduces connector height compared to through-hole alternatives, enabling slimmer enclosures in embedded computing and test-equipment chassis. Tape-and-reel packaging suits high-volume automated assembly in telecommunications infrastructure and industrial control boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-127-04-S-DH-A-K-TR datasheet?
TSM-127-04-S-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-127-04-S-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-127-04-S-DH-A-K-TR offer and what pitch spacing does it use?
The TSM-127-04-S-DH-A-K-TR provides 54 positions arranged in a dual-row configuration on a 2.54 mm (0.100 inch) pitch, which is the industry-standard spacing compatible with common 0.1-inch header footprints. This combination allows routing 54 independent signal or power lines in approximately 35 mm of PCB edge length, making it efficient for FPGA I/O expansion and backplane signal distribution.
For automated assembly lines, how does the tape-and-reel packaging of the TSM-127-04-S-DH-A-K-TR reduce production costs?
The TR (tape-and-reel) packaging format allows pick-and-place machines to feed connectors directly without manual tray handling, reducing per-unit placement cycle time by roughly 30% compared to tray-fed parts. For production runs of 500 or more boards with 54-position connectors, this translates to measurable labor savings and lower defect rates from consistent machine placement at 2.54 mm pitch accuracy.
Is the TSM-127-04-S-DH-A-K-TR interchangeable with other 54-pin 2.54 mm pitch SMT headers from competing vendors?
The 2.54 mm pitch and 54-position dual-row layout of the TSM-127-04-S-DH-A-K-TR follow industry-standard footprint conventions, making it dimensionally compatible with equivalent headers from Wurth Elektronik, Amphenol, and Molex in the same 0.100-inch pitch family. However, stack height, plating material (gold vs. tin), and current rating per pin (typically 1 A to 3 A at 250 V) may differ, so verify the datasheet for your specific application before substituting.
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