TSM-127-03-STL-DH-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-03-STL-DH-P-TR is a 54-position surface-mount terminal strip with 0.100" (2.54 mm) pitch in a dual-row, super-thin-low-profile configuration. Supplied in tape-and-reel packaging, it enables high-density PCB interconnects in compact embedded and industrial systems requiring minimized connector stack height.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-03-STL-DH-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row layout at 0.100" (2.54 mm) pitch for compatibility with standard PCB grids
- Super-thin low-profile (-STL) design minimizing connector height for compact board stack assemblies
- Surface-mount termination supporting lead-free SMT reflow soldering profiles up to 260°C
- Tape-and-reel (-TR) packaging enabling high-throughput automated pick-and-place PCB assembly
- 27 positions per row configuration supporting high-density signal routing in space-constrained modules
Applications
The TSM-127-03-STL-DH-P-TR is applied in slim embedded computing modules, portable instrumentation, and space-constrained industrial boards where a 54-pin surface-mount connection at 0.100" pitch must minimize vertical clearance. Its super-thin low-profile design and tape-and-reel packaging support efficient automated assembly in high-volume production of backplane interconnects, expansion boards, and modular control platforms requiring compact multi-signal connectivity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What differentiates the -STL (super-thin low-profile) variant of the TSM-127-03 from the standard profile version?
The -STL suffix designates a super-thin low-profile body height, which is shorter than both the standard and standard low-profile (-TL) versions. For a 54-position connector at 2.54 mm pitch, this height reduction can save several millimeters of vertical PCB clearance, which is essential in slim embedded modules, wearable devices, and layered PCB assemblies.
How does the 54-position dual-row design of the TSM-127-03-STL-DH-P-TR compare to using three separate 18-position connectors?
Using a single 54-position dual-row connector at 2.54 mm pitch reduces the number of discrete connector placements from 3 to 1, saving pick-and-place machine cycles and reducing alignment error risk. The unified 27 pins per row footprint also results in a smaller total PCB area compared to three separate connectors with their individual keepout zones.
What SMT reflow process parameters apply to assembling the TSM-127-03-STL-DH-P-TR on a PCB?
This surface-mount connector is compatible with standard lead-free reflow profiles per JEDEC J-STD-020, with a peak soldering temperature of 260°C for no more than 10 seconds. The plastic/epoxy housing maintains dimensional stability across the reflow cycle, ensuring consistent pin alignment in the 54-position 2.54 mm pitch footprint after soldering.
When is the TSM-127-03-STL-DH-P-TR a better procurement choice than the TSM-127-03-S-DH-A-K-TR for the same application?
The TSM-127-03-STL-DH-P-TR is preferred when minimizing connector body height is more critical than polarization protection, since it offers the super-thin low-profile (-STL) form without the keying (-K) feature. At 54 positions and 2.54 mm pitch, this trades mating-orientation protection for a reduced vertical envelope, making it the right fit for slim stacked-board designs where the mating pair can be visually aligned during assembly.
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