TSM-127-03-SS-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-03-SS-DH-A-K-TR is a 54-position dual-row surface-mount terminal strip with 2.54 mm (0.100 inch) pitch, stainless steel contacts, and tape-and-reel packaging, designed for high-density SMT board-to-board and wire-to-board signal connections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-127-03-SS-DH-A-K-TR?
- 54 positions in dual-row layout with 2.54 mm pitch for high-density SMT connections
- Stainless steel contacts offering excellent durability and corrosion resistance
- Tape-and-reel packaging (TR suffix) enabling automated pick-and-place assembly
- Surface-mount termination compatible with standard reflow soldering processes
What is TSM-127-03-SS-DH-A-K-TR used for?
The TSM-127-03-SS-DH-A-K-TR is suited for high-density signal routing on computing boards, communication modules, and embedded system backplanes requiring 54 SMT contacts in a compact 2.54 mm pitch layout. Its tape-and-reel packaging and surface-mount termination make it ideal for high-volume automated PCB assembly in industrial electronics, networking equipment, and data acquisition systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-127-03-SS-DH-A-K-TR datasheet?
TSM-127-03-SS-DH-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-127-03-SS-DH-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 2.54 mm pitch of the TSM-127-03-SS-DH-A-K-TR enable compatibility with standard protoboard and development tooling?
The 2.54 mm (0.100 inch) pitch matches the standard grid spacing used on breadboards, DIP sockets, and development modules, allowing the 54-position TSM-127-03-SS-DH-A-K-TR to interface directly with prototype hardware. This spacing also accommodates 28 AWG to 24 AWG wire per contact in wire-to-board connections without excessive crosstalk.
What manufacturing advantages does the tape-and-reel packaging of the TSM-127-03-SS-DH-A-K-TR provide for SMT assembly lines?
Tape-and-reel packaging allows the 54-position TSM-127-03-SS-DH-A-K-TR to be fed automatically through pick-and-place machines at production rates exceeding 1000 placements per hour. The TR suffix ensures consistent part orientation during placement, reducing misalignment errors and enabling reflow soldering at peak temperatures up to 260°C for lead-free processes.
In which applications does the dual-row 54-position configuration of the TSM-127-03-SS-DH-A-K-TR provide a routing advantage over single-row headers?
Dual-row configuration doubles contact density in the same board length, routing 54 signals (27 per row) versus 27 signals for a single-row alternative. This makes the TSM-127-03-SS-DH-A-K-TR ideal for FPGA daughtercard interfaces, parallel bus backplanes, and multi-channel sensor arrays where 54 signal lines must fit within a constrained PCB edge zone.
How do stainless steel contacts in the TSM-127-03-SS-DH-A-K-TR benefit long-service-life industrial electronics?
Stainless steel contacts resist oxidation and mechanical wear, maintaining contact resistance below typical 30 mΩ threshold across hundreds of mating cycles. In industrial panels and field instruments exposed to elevated humidity or frequent cable disconnections, the TSM-127-03-SS-DH-A-K-TR sustains reliable electrical continuity over the full -40°C to +105°C operating temperature range.
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