TSM-127-03-SM-DH-A-K-TR SAMTEC Connector (Other) In Stock
TSM-127-03-SM-DH-A-K-TR is a 54-position dual-row 0.100 inch pitch surface-mount terminal strip by SAMTEC. Key specs: SMT mounting, dual-row 27×2 layout, 2.54 mm contact spacing, tape-and-reel packaging. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row terminal strip on 0.100 inch (2.54 mm) pitch for high-density SMT board interconnects
- Surface-mount termination style eliminates through-hole drilling, reducing PCB fabrication cost and assembly time
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly for high-volume production
- SAMTEC quality construction ensures consistent contact retention and mating reliability across industrial temperature ranges
Applications
The SAMTEC TSM-127-03-SM-DH-A-K-TR surface-mount terminal strip is used in backplane interconnect systems, test-and-measurement equipment, and industrial control cards where 54 SMT signal connections are required in a compact dual-row footprint. Its 0.100 inch pitch matches standard 2.54 mm grid PCB layouts, making it compatible with a wide range of mating connectors and daughter-card assemblies. The tape-and-reel packaging makes it well suited for automated SMT assembly lines in communications and computing hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SAMTEC TSM-127-03-SM-DH-A-K-TR terminal strip provide?
The TSM-127-03-SM-DH-A-K-TR provides 54 total positions arranged in a dual-row (DH) configuration of 27 positions per row, with a 0.100 inch (2.54 mm) contact pitch. This dual-row layout allows high-density signal routing on standard 2.54 mm grid PCBs used in embedded computing and industrial backplane designs.
Is TSM-127-03-SM-DH-A-K-TR available in tape-and-reel packaging for automated SMT assembly?
Yes, the TR suffix in TSM-127-03-SM-DH-A-K-TR designates tape-and-reel packaging, making it fully compatible with automated pick-and-place machines for high-volume SMT assembly. The 0.100 inch pitch pads are also compatible with standard 2.54 mm grid PCB footprints used on most industrial and computing board designs.
What type of PCB mounting does TSM-127-03-SM-DH-A-K-TR use, and how does this affect board design?
The TSM-127-03-SM-DH-A-K-TR uses surface-mount technology (SMT), meaning no through-hole drilling is required, which reduces PCB layer count complexity. This allows placement on single-layer pads with 2.54 mm pitch, simplifying the board stackup and enabling placement of the 54-pin connector on either side of the PCB.
Which SAMTEC mating connectors are compatible with TSM-127-03-SM-DH-A-K-TR?
The TSM series on 0.100 inch (2.54 mm) pitch is designed to mate with SAMTEC SSM, SSW, and TSW series connectors, as well as industry-standard 2.54 mm pitch dual-row headers. This cross-compatibility with 100-mil grid connectors makes it easy to source mating 54-position headers for prototyping or production daughter-card assemblies.
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