TSM-127-03-L-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-03-L-DH-A-K-TR is a 54-position dual-row surface mount terminal strip with 0.100" (2.54 mm) pitch and low-profile dual-height body for versatile PCB stacking applications. Supplied in tape-and-reel format for automated SMT assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-03-L-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row SMT terminal strip at 0.100" (2.54 mm) pitch providing standard-pitch high-position-count PCB connections
- Low-profile dual-height (DH) design allows mating with connectors at two different board-to-board clearance heights
- Tape-and-reel (TR) packaging enables automated pick-and-place SMT assembly for high-volume production efficiency
Applications
The TSM-127-03-L-DH-A-K-TR is designed for backplane interconnects, CPU carrier boards, and industrial control systems that require 54-position dual-row SMT connectivity at 0.100" pitch. The dual-height body provides flexibility for mating connectors in boards with varying component clearance profiles. Tape-and-reel delivery makes it straightforward to integrate into automated high-volume assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch does the TSM-127-03-L-DH-A-K-TR offer?
The TSM-127-03-L-DH-A-K-TR provides 54 positions in a dual-row arrangement at 0.100" (2.54 mm) pitch, which is a standard spacing widely compatible with mating receptacles used in backplane, industrial control, and embedded computing PCB assemblies.
How does the dual-height design of the TSM-127-03-L-DH-A-K-TR add flexibility in PCB stack design?
The dual-height (DH) body allows the TSM-127-03-L-DH-A-K-TR to mate with connectors at different board-to-board separations, which is important in stacked PCB systems where a daughter board carries through-hole or tall SMT components that increase the required clearance above 54-pin interconnect areas.
When should an engineer select the TSM-127-03-L-DH-A-K-TR over a single-height TSM variant?
The dual-height TSM-127-03-L-DH-A-K-TR should be selected when mating boards in the stack have components taller than the standard single-height envelope at 0.100" pitch; the 54-position DH variant accommodates those clearances without requiring a custom standoff or rerouting 54 signal lines to a non-standard pitch connector.
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