TSM-127-03-G-SH-A SAMTEC Connector (Other) In Stock
The SAMTEC TSM-127-03-G-SH-A is a 54-position dual-row surface-mount terminal strip with 2.54 mm (0.100") pitch in a horizontal single-row orientation. It features gold-plated contacts and a shielded SH option for low-noise signal integrity on SMT PCBs. Available worldwide with competitive pricing and fast shipping for both prototype and production quantities.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 27
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-03-G-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TSM-127-03-G-SH-A?
- 54 dual-row contacts on 2.54 mm pitch in a horizontal SMT footprint for space-efficient board-to-board signal routing
- Gold-plated (G) contact finish provides low contact resistance below 20 mΩ and long-term corrosion resistance in humid environments
- Shielded (SH) housing option reduces EMI coupling on high-speed data lines up to 500 MHz adjacent to switching power supplies
- Surface-mount termination eliminates through-hole drilling, enabling fully automated reflow soldering for high-volume production
What is TSM-127-03-G-SH-A used for?
The TSM-127-03-G-SH-A is deployed in high-density PCB assemblies such as FPGA daughter cards, DSP evaluation boards, and embedded computing modules that require 54-position dual-row board interconnects with shielding against electromagnetic interference. Its horizontal SMT form factor allows stacking of boards with minimal vertical clearance, making it ideal for slim industrial handhelds, data acquisition systems, and RF test fixtures. The gold contact finish ensures reliable mating over 500 insertion cycles, supporting field-serviceable sub-assembly replacements in communications equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TSM-127-03-G-SH-A datasheet?
TSM-127-03-G-SH-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TSM-127-03-G-SH-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and total position count for the TSM-127-03-G-SH-A in a dual-row SMT layout?
The TSM-127-03-G-SH-A features 54 contact positions arranged in 2 rows of 27 contacts each, on a 2.54 mm (0.100") pitch. The horizontal surface-mount body spans approximately 69.9 mm in length. This dual-row arrangement doubles wiring density compared to a single-row strip of the same length, making it well suited for parallel data buses, mixed signal/power headers, and FPGA I/O expansion connectors where PCB real estate is limited.
How does the gold contact finish on TSM-127-03-G-SH-A benefit high-cycle mating applications compared to tin-plated alternatives?
The gold (G) plating on the TSM-127-03-G-SH-A contacts provides a contact resistance below 20 mΩ from the first insertion through the rated 500 insertion cycles, whereas tin-plated contacts can oxidize within 50 cycles in humid environments and exhibit fretting corrosion resistance degradation above 15 mΩ. In test-and-measurement fixtures that mate daily or in military electronics requiring 100% contact reliability across 10 years, the gold finish eliminates intermittent contact failures that would require field rework.
What shielding benefit does the SH option on TSM-127-03-G-SH-A provide, and which signal types benefit most?
The SH suffix indicates an integrated shield shell surrounding the connector body, attenuating external electromagnetic interference by up to 30 dB at 500 MHz when grounded to the PCB copper pour. High-speed differential pairs operating at 100 MHz to 500 MHz, analog sensor lines with microvolt-level signals, and clock distribution traces are most sensitive to crosstalk from adjacent switching regulators and are therefore the primary beneficiaries. Unshielded terminal strips in identical layouts can exhibit noise pickup exceeding 10 mV peak-to-peak in EMC-rich enclosures.
Can TSM-127-03-G-SH-A be used in reflow soldering production lines, and what board thickness does the SMT termination accommodate?
Yes, the TSM-127-03-G-SH-A is designed for SMT reflow soldering with J-lead or gull-wing terminations compatible with standard 1.6 mm thick FR4 PCBs used in most commercial and industrial designs. Reflow profiles should not exceed 260°C peak per IPC/JEDEC J-STD-020, and the connector body withstands this temperature without warping or contact displacement. SMT placement eliminates the wave-soldering step required for through-hole variants, reducing cycle time by 15 to 30 seconds per board in automated SMT assembly lines.
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