TSM-127-03-FM-SH-A SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-03-FM-SH-A is a 27-position dual-row surface-mount terminal strip with 0.100" (2.54 mm) pitch, horizontal single-row profile, and shielded construction for secure PCB-to-board signal routing. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 27
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-03-FM-SH-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 27 positions at 0.100" (2.54 mm) pitch provide high-density signal routing in a surface-mount footprint
- Dual-row layout maximizes pin count within a compact horizontal board space
- Surface-mount termination eliminates through-hole drilling for streamlined PCB fabrication
- Shielded housing option (SH suffix) reduces EMI susceptibility in noise-sensitive signal lines
Applications
The TSM-127-03-FM-SH-A is used in high-density embedded computing boards, FPGA development platforms, and signal acquisition systems where 27 dual-row pins must be routed in a tight 0.100" pitch surface-mount footprint. Its horizontal single-row profile keeps the connector height low, making it an excellent fit for stacked board architectures and low-profile enclosures. Engineers select this part for industrial data acquisition cards and communication interface boards requiring shielded, high pin-count edge connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-127-03-FM-SH-A provide and at what pitch?
The TSM-127-03-FM-SH-A offers 27 positions arranged in a dual-row configuration at a 0.100" (2.54 mm) pitch. This combination delivers a total of 54 electrical contacts in a compact surface-mount footprint, enabling high-density interconnects on boards where space is constrained.
What design advantage does the shielded (SH) housing of the TSM-127-03-FM-SH-A provide in EMI-sensitive systems?
The shielded housing minimizes electromagnetic interference coupling into high-speed data lines running through the connector, which is critical in systems operating above 50 MHz or located near switching power supplies. FPGA-to-processor interface boards and signal acquisition front-ends benefit from this shielding to preserve signal fidelity across the 27-position dual-row connector.
Why choose a surface-mount terminal strip like the TSM-127-03-FM-SH-A over a through-hole alternative for a compact PCB design?
Surface-mount termination eliminates the need for drilled vias under the connector, freeing inner PCB layers for additional routing and reducing board thickness in stacked module designs. For a 27-position 0.100" pitch dual-row strip, the SMT footprint also reduces solder joint variation compared to through-hole clinching, improving automated assembly yield in high-volume production runs.
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