TSM-127-03-F-DH-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-127-03-F-DH-A-K-TR is a 54-position dual-row surface-mount terminal strip on a 2.54 mm (0.100") pitch with gold-plated contacts for reliable signal connectivity. Designed for high-density board-to-board and wire-to-board connections in compact electronic assemblies. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TSM-127-03-F-DH-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row 2.54 mm pitch layout providing high-density SMT connectivity in a compact footprint
- Gold-plated contact finish ensuring low contact resistance and long-term corrosion resistance across many mating cycles
- Surface-mount terminal strip design compatible with automated reflow soldering for efficient high-volume PCB assembly
Applications
The TSM-127-03-F-DH-A-K-TR connects daughterboards and modules in embedded computing, test equipment, and industrial control systems requiring 54 signal contacts at 2.54 mm pitch. Its surface-mount form factor suits backplane interconnects, FPGA development boards, and communication modules where dense, low-profile connectors save board space. Robotics controllers, measurement instruments, and aerospace avionics also leverage this terminal strip for reliable multi-signal routing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 2.54 mm pitch and 54-position layout of the TSM-127-03-F-DH-A-K-TR compare to higher-density alternatives?
The TSM-127-03-F-DH-A-K-TR uses a standard 2.54 mm (0.100") pitch across 54 positions in a dual-row configuration, offering a well-established footprint compatible with legacy and new PCB designs. Compared to 1.27 mm pitch connectors, the 2.54 mm spacing provides wider creepage distances and easier manual assembly, while still accommodating 54 contacts in a manageable surface-mount package suitable for test and industrial boards.
What contact plating specification of the TSM-127-03-F-DH-A-K-TR makes it suitable for low-level signal applications?
SAMTEC's TSM series typically employs gold-plated contact surfaces, delivering contact resistance below 20 mΩ per pin for reliable low-level signal transmission. Gold plating prevents oxidation across repeated mating cycles, making the 54-position TSM-127-03-F-DH-A-K-TR suitable for sensitive analog measurement lines and digital logic signals where contact resistance variability would degrade signal integrity over the connector's rated mating cycle life.
For a modular embedded system needing 54 I/O lines, how does the taped-and-reeled (TR) packaging of this SAMTEC connector aid production?
The -TR tape-and-reel packaging of the TSM-127-03-F-DH-A-K-TR feeds directly into pick-and-place machines, enabling high-volume automated SMT assembly without manual component handling. This reduces placement errors on 54-pin connectors where misalignment by even 1 position would misroute signals. Tape reel packaging also simplifies inventory management for production runs requiring thousands of units, cutting assembly cost and scrap rate compared to tray-packaged connectors.
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